[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Tominaga et al., 2024 - Google Patents

Application of Visible ThermoDynamic Imaging Technology for Hotspot Detection in Failure Analysis

Tominaga et al., 2024

Document ID
15173090646890692423
Author
Tominaga S
Chinone N
Uchikado A
Aoshima Y
Nakamura T
Matsumoto T
Jung Y
Lee S
Han S
Kim H
Ikesu M
Publication year
Publication venue
International Symposium for Testing and Failure Analysis

External Links

Snippet

Thermal imaging capability is one of the key technique due to emerging three dimensional (3D) devices. Thermo-reflectance is promising candidate for high speed and high sensitive thermal imaging especially for 3D structured and metal-covered devices. A system which …
Continue reading at dl.asminternational.org (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/636Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited using an arrangement of pump beam and probe beam; using the measurement of optical non-linear properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry
    • G01J5/02Details
    • G01J5/04Casings Mountings
    • G01J5/041Mountings in enclosures or in a particular environment
    • G01J5/043Prevention or determination of dust, smog or clogging
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry
    • G01J5/0003Radiation pyrometry for sensing the radiant heat transfer of samples, e.g. emittance meter

Similar Documents

Publication Publication Date Title
US6078183A (en) Thermally-induced voltage alteration for integrated circuit analysis
KR101009455B1 (en) Fault analysis method and fault analysis device
KR100734186B1 (en) Apparatus and method for dynamic diagnostic testing of integrated circuits
US5422498A (en) Apparatus for diagnosing interconnections of semiconductor integrated circuits
WO2016129305A1 (en) Inspection device and inspection method
JP4846902B2 (en) Method and apparatus for directly measuring voltage in an integrated circuit using an infrared laser probe
WO2010024324A1 (en) Semiconductor inspection device and inspection method
Phang et al. A review of laser induced techniques for microelectronic failure analysis
Breitenstein et al. Thermal failure analysis by IR lock-in thermography
US7045786B2 (en) Method of photocarrier radiometry of semiconductors
Isenberg et al. Spatially resolved evaluation of power losses in industrial solar cells by illuminated lock‐in thermography
Yazawa et al. Time-resolved thermoreflectance imaging for thermal testing and analysis
JP3175766B2 (en) Non-destructive inspection device and non-destructive inspection method
KR20190057271A (en) Semiconductor device inspection method and semiconductor device inspection apparatus
Tay et al. Lock-in thermography application in flip-chip packaging for short defect localization
Tominaga et al. Application of Visible ThermoDynamic Imaging Technology for Hotspot Detection in Failure Analysis
US4640626A (en) Method and apparatus for localizing weak points within an electrical circuit
Tan et al. Fault localization using infra-red lock-in thermography for SOI-based advanced microprocessors
Kim et al. Backside thermal fault localization using laser scanning confocal thermoreflectance microscopy based on auto-balanced detection
JP2004327858A (en) Method and device for inspecting semiconductor device
RU2392687C1 (en) Method of inspecting integrated circuits
Koshikawa et al. Application to thermal analysis using optical probe technique
RU2187173C2 (en) Device for checking hidden interface between contacting surfaces (alternatives)
JP5333150B2 (en) Electrostatic analysis method and electrostatic analysis apparatus
Breitenstein Lock-in IR thermography for functional testing of solar cells and electronic devices