[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Robinson et al., 1998 - Google Patents

Effect of logic family on radiated emissions from digital circuits

Robinson et al., 1998

View PDF
Document ID
14929145047614758917
Author
Robinson M
Benson T
Christopoulos C
Dawson J
Ganley M
Marvin A
Porter S
Thomas D
Turner J
Publication year
Publication venue
IEEE transactions on electromagnetic compatibility

External Links

Snippet

Radiated emissions were measured for simple digital circuits designed to operate with various logic families. Emissions in the near and far field were found to depend both on the circuit layout and the choice of logic family. However, the difference in peak emissions …
Continue reading at pure.york.ac.uk (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836Fault-finding or characterising
    • G01R31/2839Fault-finding or characterising using signal generators, power supplies or circuit analysers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K3/00Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/64Generators producing trains of pulses, i.e. finite sequences of pulses
    • H03K3/72Generators producing trains of pulses, i.e. finite sequences of pulses with means for varying repetition rate of trains
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K5/00Manipulating pulses not covered by one of the other main groups in this subclass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making or -braking
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B19/00Generation of oscillations by non-regenerative frequency multiplication or division of a signal from a separate source

Similar Documents

Publication Publication Date Title
Xu et al. Power-bus decoupling with embedded capacitance in printed circuit board design
US5399996A (en) Circuit and method for minimizing electromagnetic emissions
Ricchiuti Power-supply decoupling on fully populated high-speed digital PCBs
US7355413B2 (en) Testing method/arrangement measuring electromagnetic interference of noise in a to-be-tested printed circuit board
US5781074A (en) Low electromagnetic interference clock oscillator module
Robinson et al. Effect of logic family on radiated emissions from digital circuits
Daijavad et al. Modeling common-mode radiation of 3D structures
Leone et al. On the electromagnetic radiation of printed-circuit-board interconnections
Kam et al. A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise
Sudheer Analysis of electromagnetic interference radiations from the PCB traces
Agius et al. Design of an STM32F4 microcontroller development board for switching power converters
Lavarda et al. Enhancement of the DPI method for IC immunity characterization
Deutschmann et al. Measuring the electromagnetic emissions of integrated circuits with IEC 61967-4 (the measuring method and its weaknesses)
US20030112084A1 (en) Low electromagnetic interference clock oscillator module
Su et al. Degradation of the conducted radio frequency immunity of microcontrollers due to electromagnetic resonances in foot-point loops
Robinson et al. Effect of logic family on peak radiated emissions from circuit boards
Miyazaki et al. Driver/receiver IC models for simulation of normal-mode emission
Criel et al. Design and Characterization of an Active, EMC-dedicated Testchip
Hara et al. Analysis of radiation noise caused by power distribution on multilayer printed circuit board
Chan et al. Suppression of noise from digital-to-analog coupling in shielding cavity
Montrose Time and frequency domain analysis for right angle corners on printed circuit board traces
Konefal et al. UHF intermodulation product prediction in digital systems using SPICE: the need for nonlinear macromodels
Engel Model of IC emissions into a TEM cell
Perotoni et al. Feature Selective Validation Analysis applied to the Measurement of Electronic Circuit Electromagnetic Conducted Emissions-CISPR 25
Singamsetty et al. Mitigation of EMI in High-Speed PCB designs with Dynamic Phase control