[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Li et al., 2009 - Google Patents

The impact of on-wafer calibration method on the measured results of coplanar waveguide circuits

Li et al., 2009

View PDF
Document ID
14962430295374219785
Author
Li Q
Melde K
Publication year
Publication venue
IEEE transactions on advanced packaging

External Links

Snippet

This paper compares four commonly used on-wafer calibration methods including multiline thru-reflect-line (TRL), line-reflect-reflect-match, line-reflect-match, and short-open-load-thru, for three diverse coplanar waveguide (CPW) circuits. The magnitudes and phases of S 11 …
Continue reading at www.academia.edu (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuit
    • G01R31/31903—Tester hardware, i.e. output processing circuit tester configuration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/28—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks using network analysers Measuring transient response
    • G01R27/32—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks using network analysers Measuring transient response in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08—Measuring electromagnetic field characteristics
    • G01R29/10—Radiation diagrams of aerials; Antenna testing in general
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables

Similar Documents

Publication Publication Date Title
US7532014B2 (en) LRL vector calibration to the end of the probe needles for non-standard probe cards for ATE RF testers
CN104502878B (en) Microwave GaAs substrate is in piece S parameter microstrip line TRL calibrating devices
US7439748B2 (en) Method and apparatus for measuring high-frequency electrical characteristics of electronic device, and method for calibrating apparatus for measuring high-frequency electrical characteristics
US7157918B2 (en) Method and system for calibrating a measurement device path and for measuring a device under test in the calibrated measurement device path
Shih Broadband characterization of conductor-backed coplanar waveguide using accurate on-wafer measurement techniques
US7405576B2 (en) Method and apparatus for measuring high-frequency electrical characteristics of electronic device, and method for calibrating apparatus for measuring high-frequency electrical characteristics
CN110161312B (en) One-dimensional and two-dimensional material broadband impedance measurement device and method based on microstrip line method
US20080195344A1 (en) Method for determining measurement errors in scattering parameter measurements
US7375534B2 (en) Method and apparatus for measuring high-frequency electrical characteristics of electronic device, and method for calibrating apparatus for measuring high-frequency electrical characteristics
Eccleston A new interpretation of through-line deembedding
Fregonese et al. Importance of probe choice for extracting figures of merit of advanced mmW transistors
Li et al. The impact of on-wafer calibration method on the measured results of coplanar waveguide circuits
Zhu et al. On-wafer measurement of microstrip-based circuits with a broadband vialess transition
Heinola et al. A strip line ring resonator method for determination of dielectric properties of printed circuit board material in function of frequency
Torres-Torres et al. Characterization of electrical transitions using transmission line measurements
Tag et al. Design, simulation, and fabrication of broadband coaxial matched loads for the frequency range from 0 to 110 GHz
Spirito et al. Guidelines for the design of calibration substrates, including the suppression of parasitic modes for frequencies up to and including 325 GHz: EMPIR 14IND02
JP3912429B2 (en) Method and apparatus for measuring high-frequency electrical characteristics of electronic components, and calibration method for high-frequency electrical characteristics measuring apparatus
Preuss et al. A Study on Low-Cost Calibration Kits for U. FL Connector Systems
Hammond et al. Network analyzer calibration methods for high-density packaging characterization and validation of simulation models
Arakawa et al. Calibrated 2-port microwave measurement up to 26.5 GHz for wide temperature range from 4 K to 300 K
Venter et al. Modelling Considerations for Coupled Lines in CMOS Back-End-Of-Line at mm-Wave Frequencies
Zhou et al. Four-Port Probe Calibration Using 64-Term Error Model for On-Wafer S-Parameter Measurement up to 110 GHz
Godshalk Characterization of surface mount packages at microwave frequencies using wafer probes
Li et al. Broadband on-wafer calibrations comparison for accuracy and repeatability on co-planar waveguide structures