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Chen et al., 2014 - Google Patents

Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites

Chen et al., 2014

Document ID
14492815320275801014
Author
Chen G
Yang W
Dong R
Hussain M
Wu G
Publication year
Publication venue
Materials & Design

External Links

Snippet

Abstract Thermal conductivity of SiCp/Cu composites was usually far below the expectation, which is usually attributed to the low real thermal conductivity of matrix. In the present work, highly pure Cu matrix composites reinforced with acid washed SiC particles were prepared …
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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