Chen et al., 2014 - Google Patents
Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu compositesChen et al., 2014
- Document ID
- 14492815320275801014
- Author
- Chen G
- Yang W
- Dong R
- Hussain M
- Wu G
- Publication year
- Publication venue
- Materials & Design
External Links
Snippet
Abstract Thermal conductivity of SiCp/Cu composites was usually far below the expectation, which is usually attributed to the low real thermal conductivity of matrix. In the present work, highly pure Cu matrix composites reinforced with acid washed SiC particles were prepared …
- 239000002131 composite material 0 title abstract description 99
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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