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Li et al., 2020 - Google Patents

DC IR-drop analysis of multilayered power distribution network by discontinuous Galerkin method with thermal effects incorporated

Li et al., 2020

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Document ID
13991575171746256635
Author
Li P
Tang M
Huang Z
Jiang L
Bağcı H
Publication year
Publication venue
IEEE Transactions on Components, Packaging and Manufacturing Technology

External Links

Snippet

Due to the temperature-dependent resistivity of power distribution network (PDN) interconnects, a wiser and necessary strategy is to proceed the electrical–thermal cosimulation in order to include the thermal effects caused by Joule heating. As a natural …
Continue reading at ieeexplore.ieee.org (PDF) (other versions)

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50Computer-aided design
    • G06F17/5009Computer-aided design using simulation
    • G06F17/5036Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50Computer-aided design
    • G06F17/5009Computer-aided design using simulation
    • G06F17/5018Computer-aided design using simulation using finite difference methods or finite element methods
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50Computer-aided design
    • G06F17/5068Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5081Layout analysis, e.g. layout verification, design rule check
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50Computer-aided design
    • G06F17/5045Circuit design
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/16Numerical modeling
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/78Power analysis and optimization
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/04CAD in a network environment
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/80Thermal analysis and optimization
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/02Component-based CAD
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/82Noise analysis and optimization
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/40Chip packaging
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/12Design for manufacturability

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