[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Lee et al., 2002 - Google Patents

Modeling and analysis of 3-D solenoid embedded inductors

Lee et al., 2002

View PDF
Document ID
13587210147347268020
Author
Lee S
Choi J
May G
Yun I
Publication year
Publication venue
IEEE transactions on electronics packaging manufacturing

External Links

Snippet

Investigation of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of three-dimensional (3-D) solenoid inductors manufactured in …
Continue reading at www.academia.edu (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Similar Documents

Publication Publication Date Title
Niknejad et al. Analysis of eddy-current losses over conductive substrates with applications to monolithic inductors and transformers
Niknejad et al. Analysis, design, and optimization of spiral inductors and transformers for Si RF ICs
Wang et al. An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
Chun et al. Modeling of simultaneous switching noise in high speed systems
Na et al. Modeling and transient simulation of planes in electronic packages
McCredie et al. Modeling, measurement, and simulation of simultaneous switching noise
US5566083A (en) Method for analyzing voltage fluctuations in multilayered electronic packaging structures
Gao et al. Scalable compact circuit model and synthesis for RF CMOS spiral inductors
Huang et al. Frequency-independent asymmetric double-$ pi $ equivalent circuit for on-chip spiral inductors: Physics-based modeling and parameter extraction
Kim et al. Interposer power distribution network (PDN) modeling using a segmentation method for 3-D ICs with TSVs
Kang et al. A wideband scalable and SPICE-compatible model for on-chip interconnects up to 110 GHz
Fan et al. Lumped-circuit model extraction for vias in multilayer substrates
Cho et al. A novel transmission-line deembedding technique for RF device characterization
Lee et al. Modeling and analysis of 3-D solenoid embedded inductors
Zhao et al. S parameter-based experimental modeling of high Q MCM inductor with exponential gradient learning algorithm
Poddar et al. Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process
Chen et al. A study of the high frequency performance of thin film capacitors for electronic packaging
Chen et al. A scalable model of on-chip inductor including tunable dummy metal density factor
Zhu et al. A unified finite-element solution from zero frequency to microwave frequencies for full-wave modeling of large-scale three-dimensional on-chip interconnect structures
Jin et al. Silicon substrate coupling noise modeling, analysis, and experimental verification for mixed signal integrated circuit design
Afonso et al. Modeling and electrical analysis of seamless high off-chip connectivity (SHOCC) interconnects
Hwang et al. Characterization of next generation thin low-k and low-loss organic dielectrics from 1 to 110 GHz
Lee et al. Investigation of 3-D embedded inductors using Monte Carlo analysis
Kim et al. Circuit modeling of interdigitated capacitors fabricated by high‐K LTCC sheets
Poddar et al. Accurate, rapid, high frequency empirically based predictive modeling of arbitrary geometry planar resistive passive devices