[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Logan, 2013 - Google Patents

Thermal-aware CAD for modern integrated circuits

Logan, 2013

View PDF
Document ID
13554333323094789821
Author
Logan S
Publication year

External Links

Snippet

Power density in modern integrated circuits (ICs) continues to increase at an alarming rate. In turn, larger power densities result in higher peak temperatures which can reduce chip reliability and further increase leakage power consumption. Thermal-aware CAD design is a …
Continue reading at escholarship.org (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5077—Routing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5072—Floorplanning, e.g. partitioning, placement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5081—Layout analysis, e.g. layout verification, design rule check
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5022—Logic simulation, e.g. for logic circuit operation
    • G06F17/5031—Timing analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5045—Circuit design
    • G06F17/505—Logic synthesis, e.g. technology mapping, optimisation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5018—Computer-aided design using simulation using finite difference methods or finite element methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5045—Circuit design
    • G06F17/5054—Circuit design for user-programmable logic devices, e.g. field programmable gate arrays [FPGA]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/30—Information retrieval; Database structures therefor; File system structures therefor
    • G06F17/30861—Retrieval from the Internet, e.g. browsers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/78—Power analysis and optimization
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/12—Design for manufacturability
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/80—Thermal analysis and optimization
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/70—Fault tolerant, i.e. transient fault suppression
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F1/00—Details of data-processing equipment not covered by groups G06F3/00 - G06F13/00, e.g. cooling, packaging or power supply specially adapted for computer application
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity

Similar Documents

Publication Publication Date Title
US7823102B2 (en) Thermally aware design modification
Sylvester et al. Impact of small process geometries on microarchitectures in systems on a chip
US8082137B2 (en) Method and apparatus for thermal modeling and analysis of semiconductor chip designs
US7472363B1 (en) Semiconductor chip design having thermal awareness across multiple sub-system domains
US8103996B2 (en) Method and apparatus for thermal analysis of through-silicon via (TSV)
US8010928B1 (en) Automatically routing nets according to parasitic constraint rules
Ku et al. Physical design solutions to tackle FEOL/BEOL degradation in gate-level monolithic 3D ICs
Su et al. Congestion-driven codesign of power and signal networks
Chang et al. Practical routability-driven design flow for multilayer power networks using aluminum-pad layer
Zhan et al. Electrothermal analysis and optimization techniques for nanoscale integrated circuits
Oh et al. Thermal-aware 3D symmetrical buffered clock tree synthesis
Logan Thermal-aware CAD for modern integrated circuits
Melamed et al. Junction-level thermal extraction and simulation of 3DICs
Chentouf et al. A Novel Net Weighting Algorithm for Power and Timing‐Driven Placement
Minz et al. Thermal and crosstalk-aware physical design for 3d system-on-package
Kim et al. Impact of TSV and device scaling on the quality of 3D ICs
Winther et al. Thermal aware floorplanning incorporating temperature dependent wire delay estimation
Sassone et al. Modeling and characterization of thermally induced skew on clock distribution networks of nanometric ICs
Gopalakrishnan et al. An analysis of the wire-load model uncertainty problem
Stringfellow et al. Decoupling capacitance estimation, implementation, and verification: A practical approach for deep submicron SoCs
Sassone et al. Modeling of thermally induced skew variations in clock distribution network
Zarkesh-Ha Global interconnect modeling for a gigascale system-on-a-chip (GSoC)
Chen Algorithms for VLSI design planning
Basaran et al. GeneSys: A leaf-cell layout synthesis system for GHz VLSI designs
Wilkinson Digital circuit wear-out due to electromigration in semiconductor metal lines