Shan et al., 2008 - Google Patents
Microstructure formation on low temperature co-fired ceramic green substrates using micro embossingShan et al., 2008
- Document ID
- 13490548755769243905
- Author
- Shan X
- Maw H
- Tjeung R
- Ling S
- Lu C
- Jachowicz R
- Publication year
- Publication venue
- Microsystem technologies
External Links
Snippet
Microstructures were formed on low temperature co-fired ceramic (LTCC) green substrates with high fidelity using micro embossing. The impact of embossing temperature and pattern density against the embossed profiles was investigated. The increase in pattern density …
- 238000004049 embossing 0 title abstract description 38
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Enneti et al. | Thermal debinding process in particulate materials processing | |
| Moritz et al. | Additive manufacturing of ceramic components | |
| Bordia et al. | Current understanding and future research directions at the onset of the next century of sintering science and technology | |
| KR101995940B1 (en) | Layered manufacturing of free-form multi-material micro-components | |
| An et al. | Additive manufacturing and characterization of complex Al2O3 parts based on a novel stereolithography method | |
| US5779833A (en) | Method for constructing three dimensional bodies from laminations | |
| JP5714552B2 (en) | How to produce tertiary elemental goods | |
| Jang et al. | Development of ceramic additive manufacturing: process and materials technology | |
| Shan et al. | Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing | |
| Rabe et al. | Hot embossing: an alternative method to produce cavities in ceramic multilayer | |
| Wang et al. | Multimaterial additive manufacturing of LTCC matrix and silver conductors for 3D ceramic electronics | |
| Geffroy et al. | Preparation by tape casting and hot pressing of copper carbon composites films | |
| Bernard et al. | Feasibility of manufacturing of Al2O3–Mo HTCC by hybrid additive process | |
| Bice et al. | Thermoformable boron nitride based all‐ceramics | |
| Fournier | 3D structuration techniques of LTCC for microsystems applications | |
| Tsumori et al. | Hierarchical patterning by multi-step micro-imprinting with layered materials | |
| Shan et al. | Study on micro hot embossing of low temperature co-firable ceramic green substrates | |
| KR100675324B1 (en) | Process for producing photonic crystal and photonic crystal | |
| Malecha et al. | Comparison of solvent and sacrificial volume-material-based lamination processes of low-temperature co-fired ceramics tapes | |
| Yonekura et al. | Interfacial pattern changes of imprinted multilayered material in milli-and microscales | |
| Utsch et al. | Mechanical qualification and microstructural analysis of alumina produced by material extrusion | |
| Maw et al. | Micro embossing of LTCC (low temperature co-fired ceramic) green substrates | |
| Hagen et al. | Combined 3D micro structuring of ceramic green tape using punching, embossing and laser processing | |
| Toskov et al. | LTCC lamination process using PMMA fugitive material | |
| KR20240059625A (en) | Thermoformable boron-based ceramic materials and their use in thermal management |