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Tachi et al., 2007 - Google Patents

Improvement of interface properties of W/La2O3/Si MOS structure using Al capping layer

Tachi et al., 2007

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Document ID
13396389178555699694
Author
Tachi K
Kakushima K
Ahmet P
Tsutsui K
Sugii N
Hattori T
Iwai H
Publication year
Publication venue
ECS Transactions

External Links

Snippet

Electrical characteristics of W/La2O3/Si MOS capacitors have been investigated under various annealing condition. Relatively high interface state densities (Dit) of 1012 cm-2eV-1 observed after annealing at 200 to 500 oC was effectively reduced down to 1011 cm-2eV-1 …
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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