[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Dragosavic et al., 1989 - Google Patents

The Role of the Catalyst During Currentless Copper Deposition

Dragosavic et al., 1989

Document ID
1336937224888579463
Author
Dragosavic L
Cikovic N
Publication year
Publication venue
Galvanotechnik

External Links

Continue reading at scholar.google.com (other versions)

Similar Documents

Publication Publication Date Title
EP0151413A3 (en) Auto-selective metal deposition on dielectric surfaces
EP0177686A3 (en) Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby
DE3576129D1 (en) PRESS FOR MACHINING WORKPIECES FROM METAL.
CA2286326A1 (en) Article, method, and apparatus for electrochemical fabrication
JPS5721230A (en) Positioning method in wire cut electric discharge processing
SG108591G (en) Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products
Dragosavic et al. The Role of the Catalyst During Currentless Copper Deposition
DE59102796D1 (en) System for the serial coating of workpieces with conductive coating material.
DE3277733D1 (en) Method for the deposition of metals on electrically conductive, polymeric substrates, and use of the obtained materials
DE59100712D1 (en) System for the serial coating of workpieces with conductive coating material.
FR2626270B1 (en) PROCESS FOR COFRITTING, COPPER CONDUCTORS OR COPPER-BASED ALLOYS AND THEIR CERAMIC SUBSTRATE IN CORDIERITY
GB2181297B (en) Process and relative apparatus for making ohmic type contacts between metal and semiconductor
EP0109402A4 (en) Catalyst solutions for activating non-conductive substrates and electroless plating process.
EP0568728A3 (en) Process and apparatus for electroplating perforated articles.
Martin et al. Tin and Tin--Lead Alloy Electroplating in the Electroplating Industry
Liu et al. Impurity Control of Sn 63 Soldering Bath
JPS6481181A (en) Surface treatment of metal electrode
Endress et al. Electrodeposition of Noble Metals on Printed Circuits
Biedorf Deep etching procedures in the electronic technology.
Nieber et al. The Selective and Simultaneous Deposition of Heavy Metals From Mixed Metal Solutions
Brundle et al. Application of surface analysis to circuitboard manufacturing problems.
JPS5247688A (en) Process for production of semiconductor device
Mniszek et al. First Industrial Application of the New Copper Plating Method'Cu-177'
JPS642279A (en) Manufacture of connector contact maker
Bacquias Galvanic and Chemical Techniques in the Electronic Industry