Sladek et al., 2019 - Google Patents
Laser induced damage threshold of silicon with native and artificial SiO2 layerSladek et al., 2019
View PDF- Document ID
- 13274088185981435796
- Author
- Sladek J
- Mirza I
- Publication year
- Publication venue
- Mod. Mach. Sci. J
External Links
Snippet
Efficient and successful laser processing of materials requires a precise control of processing parameters, especially laser energy fluence. Therefore, an accurate knowledge of the beam spot size is essential for this purpose. In some cases, it is not possible to use a …
- 229910052710 silicon 0 title abstract description 47
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
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