[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Lin et al., 2013 - Google Patents

Miniature Butler matrix design using glass-based thin-film integrated passive device technology for 2.5-GHz applications

Lin et al., 2013

Document ID
13049526835875242532
Author
Lin Y
Lee J
Publication year
Publication venue
IEEE Transactions on Microwave Theory and Techniques

External Links

Snippet

In this paper, miniature branch-line coupler and Butler matrix designs for 2.5-GHz applications are proposed using the glass-based thin-film integrated passive device (TF- IPD) technology. The size reduction is achieved by replacing the quarter-wavelength …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q1/00—Details of, or arrangements associated with, aerials
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q9/00—Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant aerials
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0428—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave
    • H01Q9/0435—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave using two feed points
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q9/00—Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant aerials
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q21/00—Aerial arrays or systems
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

Similar Documents

Publication Publication Date Title
Lin et al. Miniature Butler matrix design using glass-based thin-film integrated passive device technology for 2.5-GHz applications
Watanabe et al. A review of 5G front-end systems package integration
Zhang et al. An overview of the development of antenna-in-package technology for highly integrated wireless devices
Cetinoneri et al. An 8$\,\times\, $8 Butler Matrix in 0.13-$\mu {\hbox {m}} $ CMOS for 5–6-GHz Multibeam Applications
Zihir et al. 60-GHz 64-and 256-elements wafer-scale phased-array transmitters using full-reticle and subreticle stitching techniques
Lamminen et al. 60-GHz patch antennas and arrays on LTCC with embedded-cavity substrates
Shin et al. A 108–114 GHz 4$\,\times\, $4 Wafer-Scale Phased Array Transmitter With High-Efficiency On-Chip Antennas
de Kok et al. A review of design and integration technologies for D-band antennas
Hagelauer et al. Integrated systems-in-package: Heterogeneous integration of millimeter-wave active circuits and passives in fan-out wafer-level packaging technologies
Yu et al. A wideband mmWave antenna in fan-out wafer level packaging with tall vertical interconnects for 5G wireless communication
Amadjikpe et al. Integrated 60-GHz antenna on multilayer organic package with broadside and end-fire radiation
Hong et al. Grid assembly-free 60-GHz antenna module embedded in FR-4 transceiver carrier board
Kuo et al. A fully SiP integrated $ V $-band Butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC
SeyyedEsfahlan et al. 77-GHz four-element phased-array radar receiver front end
Maktoomi et al. A sub-terahertz wideband stacked-patch antenna on a flexible printed circuit for 6G applications
Titz et al. New wideband miniature branchline coupler on IPD technology for beamforming applications
US9160050B2 (en) Planar balun transformer device
Chi et al. A compact wideband millimeter-wave quadrature hybrid coupler using artificial transmission lines on a glass substrate
Fang et al. 2.4-GHz absorptive MMIC switch for switched beamformer application
Choi et al. A $ V $-Band Switched Beam-Forming Antenna Module Using Absorptive Switch Integrated With 4$\,\times\, $4 Butler Matrix in 0.13-$\mu {\hbox {m}} $ CMOS
Chin et al. A 24-GHz CMOS Butler Matrix MMIC for multi-beam smart antenna systems
Wang et al. A broadband compact low-loss 4× 4 butler matrix in CMOS with stacked transformer based quadrature couplers
Zou et al. Heterogeneous integrated beam-switching/retrodirective array using synthesized transmission lines
Lee et al. LTCC‐based monolithic system‐in‐package (SiP) module for millimeter‐wave applications
Kam et al. Low-cost antenna-in-package solutions for 60-GHz phased-array systems