Liu et al., 2016 - Google Patents
Extremely fast formation of CuSn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding processLiu et al., 2016
- Document ID
- 12841910579871207586
- Author
- Liu B
- Tian Y
- Wang C
- An R
- Liu Y
- Publication year
- Publication venue
- Journal of Alloys and Compounds
External Links
Snippet
High-temperature-stable circuit interconnects are highly desirable for the wide band-gap semiconductor devices to operate in harsh environment (> 200° C). In this study, a full Cu 3 Sn interconnect with the melting point of 679° C was fabricated by using a micro-resistance …
- 238000000034 method 0 title abstract description 35
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2201/00—Articles made by soldering, welding or cutting by applying heat locally
- B23K2201/36—Electric or electronic devices
- B23K2201/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Liu et al. | Extremely fast formation of CuSn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process | |
| Zuo et al. | Intermediate layer characterization and fracture behavior of laser-welded copper/aluminum metal joints | |
| Shao et al. | Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound | |
| Xiao et al. | Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal | |
| Liu et al. | Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process | |
| Zhang et al. | Effect of Sb content on properties of Sn—Bi solders | |
| Liu et al. | A high-entropy alloy as very low melting point solder for advanced electronic packaging | |
| Tu et al. | Influence of Ce addition on Sn-3.0 Ag-0.5 Cu solder joints: thermal behavior, microstructure and mechanical properties | |
| Liu et al. | Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current | |
| Mokhtari et al. | The shear strength of transient liquid phase bonded Sn–Bi solder joint with added Cu particles | |
| Wei et al. | Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints | |
| Kim et al. | Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration | |
| Anderson et al. | Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints | |
| Huiwen et al. | Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering | |
| Zhao et al. | Ultrasonic-assisted liquid phase diffusion bonding of Al alloys under low temperature and pressure for high-temperature resistance applications | |
| Chen et al. | Transient liquid phase bonding with Ga-based alloys for electronics interconnections | |
| Feng et al. | Effects of Ti on the brazability of Zn-22Al-xTi filler metals as well as properties of Cu/Al brazing joints | |
| Sun et al. | The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method | |
| Zhang et al. | Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC | |
| Shu et al. | Ultrasonic powder consolidation of Sn/In nanosolder particles and their application to low temperature Cu-Cu joining | |
| Huang et al. | Migration behavior of indium atoms in Cu/Sn–52In/Cu interconnects during electromigration | |
| Chen et al. | Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni (P)/Kovar joint by ultrasonic-assisted soldering method | |
| Liu et al. | Microstructure and properties of AgCu/2 wt% Ag-added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering | |
| Zhu et al. | Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film | |
| Chang et al. | Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows |