Murarka et al., 2012 - Google Patents
Printed MEMS membranes on siliconMurarka et al., 2012
View PDF- Document ID
- 1273920773102609571
- Author
- Murarka A
- Paydavosi S
- Andrew T
- Wang A
- Lang J
- Bulovic V
- Publication year
- Publication venue
- 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)
External Links
Snippet
We report a new method for additive fabrication of thin (125±15 nm thick) gold membranes on patterned silicon dioxide (SiO 2) substrates for acoustic MEMS. The deflection of these membranes, suspended over cavities in a SiO 2 dielectric layer atop a conducting electrode …
- 239000012528 membrane 0 title abstract description 67
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8963262B2 (en) | Method and apparatus for forming MEMS device | |
| Thouti et al. | Flexible capacitive pressure sensors using microdome like structured polydimethylsiloxane dielectric layers | |
| JP4531980B2 (en) | Method for manufacturing a capacitive ultrasonic transducer | |
| Yamaner et al. | A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding | |
| JP3616055B2 (en) | Method for producing anti-adhesion microstructure | |
| US6060336A (en) | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore | |
| CN112362199B (en) | Medium insertion type capacitive pressure sensor and preparation method thereof | |
| CN111742199B (en) | Layered structure and manufacturing method thereof | |
| CN100436306C (en) | Touch sensor and its manufacture method | |
| CN103234567B (en) | MEMS (micro-electromechanical systems) capacitive ultrasonic sensor on basis of anodic bonding technology | |
| TWI738804B (en) | Mems device and process | |
| JPH02290524A (en) | Semiconductor wafer, forming method of the same, transducer and manufacturing method of the same | |
| Yildirim et al. | Piezoelectric membrane actuators for micropump applications using PVDF-TrFE | |
| US10570005B2 (en) | Method and apparatus for release-assisted microcontact printing of MEMS | |
| US10421665B2 (en) | Process for the formation of a graphene membrane component, graphene membrane component, microphone and hall-effect sensor | |
| WO2013033032A2 (en) | Method and apparatus for release-assisted microcontact printing of mems | |
| CN112033526A (en) | Vibration sensor and method for manufacturing the same | |
| WO2019019783A1 (en) | Wide-range high-precision double-film-integrated capacitive pressure sensor and preparation method therefor | |
| WO2003030234A1 (en) | Method for forming a cavity structure on soi substrate and cavity structure formed on soi substrate | |
| Murarka et al. | Printed MEMS membranes on silicon | |
| JP6344848B2 (en) | Reduction of stiction in microelectromechanical systems by forming silicon carbide layers | |
| WO2009057988A3 (en) | Radio frequency mems switch | |
| Murarka et al. | Micro-contact printed MEMS | |
| WO2011046986A2 (en) | Method and apparatus for forming mems device | |
| CN110570836B (en) | Ultrasonic transducer and preparation method thereof |