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Gilmer et al., 2002 - Google Patents

Compatibility of polycrystalline silicon gate deposition with HfO2 and Al2O3/HfO2 gate dielectrics

Gilmer et al., 2002

Document ID
12604691571881063025
Author
Gilmer D
Hegde R
Cotton R
Garcia R
Dhandapani V
Triyoso D
Roan D
Franke A
Rai R
Prabhu L
Hobbs C
Grant J
La L
Samavedam S
Taylor B
Tseng H
Tobin P
Publication year
Publication venue
Applied physics letters

External Links

Snippet

Polycrystalline-silicon poly-Si gate compatibility issues with HfO2 and Al2O3 capped HfO2 gate dielectrics are reported. It can be generally stated that chemical vapor deposition CVD silicon gates using silane deposited directly onto HfO2 results in electrical properties much …
Continue reading at pubs.aip.org (other versions)

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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158Making the insulator
    • H01L21/28167Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H01L21/28194Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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