[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Chouichi et al., 2020 - Google Patents

Chamber-to-chamber discrepancy detection in semiconductor manufacturing

Chouichi et al., 2020

Document ID
12416748658306544873
Author
Chouichi A
Blue J
Yugma C
Pasqualini F
Publication year
Publication venue
IEEE Transactions on Semiconductor Manufacturing

External Links

Snippet

For reasons of productivity and throughput maximization, semiconductor equipment suppliers provide multiple-chamber machines to allow the split of production runs over parallel chambers. These latter are expected to perform identically and fabricate similar …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06K—RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00—Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/62—Methods or arrangements for recognition using electronic means
    • G06K9/6217—Design or setup of recognition systems and techniques; Extraction of features in feature space; Clustering techniques; Blind source separation
    • G06K9/6232—Extracting features by transforming the feature space, e.g. multidimensional scaling; Mappings, e.g. subspace methods
    • G06K9/6247—Extracting features by transforming the feature space, e.g. multidimensional scaling; Mappings, e.g. subspace methods based on an approximation criterion, e.g. principal component analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06K—RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00—Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/62—Methods or arrangements for recognition using electronic means
    • G06K9/6267—Classification techniques
    • G06K9/6279—Classification techniques relating to the number of classes
    • G06K9/6284—Single class perspective, e.g. one-against-all classification; Novelty detection; Outlier detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06K—RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00—Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/62—Methods or arrangements for recognition using electronic means
    • G06K9/6267—Classification techniques
    • G06K9/6268—Classification techniques relating to the classification paradigm, e.g. parametric or non-parametric approaches
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06K—RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00—Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/62—Methods or arrangements for recognition using electronic means
    • G06K9/6217—Design or setup of recognition systems and techniques; Extraction of features in feature space; Clustering techniques; Blind source separation
    • G06K9/6228—Selecting the most significant subset of features
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06K—RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00—Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/62—Methods or arrangements for recognition using electronic means
    • G06K9/6201—Matching; Proximity measures

Similar Documents

Publication Publication Date Title
Fan et al. Data-driven approach for fault detection and diagnostic in semiconductor manufacturing
Chouichi et al. Chamber-to-chamber discrepancy detection in semiconductor manufacturing
Chien et al. Semiconductor fault detection and classification for yield enhancement and manufacturing intelligence
CN109716303B (en) Time series fault detection, fault classification and transition analysis
He et al. Fault detection using the k-nearest neighbor rule for semiconductor manufacturing processes
US7151976B2 (en) Multivariate control of semiconductor processes
Kim et al. Machine learning-based novelty detection for faulty wafer detection in semiconductor manufacturing
CN108062565B (en) Double-principal element-dynamic core principal element analysis fault diagnosis method based on chemical engineering TE process
KR101215367B1 (en) Etching apparatus, analysis apparatus, etching treatment method, and computer readable medium recording etching treatment program
Huang et al. Double-layer distributed monitoring based on sequential correlation information for large-scale industrial processes in dynamic and static states
JP5648157B2 (en) Semiconductor manufacturing equipment
Zeng et al. Virtual metrology modeling for plasma etch operations
Li et al. Comparative study on monitoring schemes for non-Gaussian distributed processes
Kim et al. Use of plasma information in machine-learning-based fault detection and classification for advanced equipment control
Chan et al. Just-in-time modeling with variable shrinkage based on Gaussian processes for semiconductor manufacturing
Zhong et al. Multimode non‐Gaussian process monitoring based on local entropy independent component analysis
Susto et al. Least angle regression for semiconductor manufacturing modeling
Fan et al. Key feature identification for monitoring wafer-to-wafer variation in semiconductor manufacturing
Liu et al. Nonstationary fault detection and diagnosis for multimode processes
Pan et al. Chamber matching of semiconductor manufacturing process using statistical analysis
Thieullen et al. Application of Principal Components Analysis to improve fault detection and diagnosis on semiconductor manufacturing equipment
Chang et al. Spatiotemporal pattern modeling for fault detection and classification in semiconductor manufacturing
Yu et al. Using minimum quantization error chart for the monitoring of process states in multivariate manufacturing processes
Stefatos et al. Cluster pca for outliers detection in high-dimensional data
Mellah et al. Semiconductor Multivariate Time-Series Anomaly Classification based on Machine Learning Ensemble Techniques