Yan et al., 2023 - Google Patents
Investigation on focused ultrasound-assisted diamond wire sawing of silicon carbideYan et al., 2023
- Document ID
- 12383213615258840972
- Author
- Yan L
- Chen X
- Li H
- Zhang Q
- Publication year
- Publication venue
- The International Journal of Advanced Manufacturing Technology
External Links
Snippet
Focused ultrasound-assisted diamond wire sawing (DWS) is proposed in order to improve the sawing performance in terms of sawing force, surface finish, and edge chippings. Under the streaming effect of acoustic wave, the diamond wire saw is forced to move at high …
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