Che et al., 2018 - Google Patents
Failure mode and mechanism analysis for Cu wire bond on Cu/Low-k chip by wire pull test and finite-element analysisChe et al., 2018
View PDF- Document ID
- 11824552368202482444
- Author
- Che F
- Wai L
- Chai T
- Publication year
- Publication venue
- IEEE Transactions on Device and Materials Reliability
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Snippet
In this paper, failure mode and mechanism analysis on Cu wire bond and bond pad reliability for Cu/low-k chip are investigated through wire pull test and finite-element analysis (FEA). The wire pull test has been carried out for the bonded Cu wires with changing pull …
- 238000004458 analytical method 0 title abstract description 23
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