Schneider et al., 1997 - Google Patents
Integrated micromachined decoupled CMOS chip on chipSchneider et al., 1997
- Document ID
- 11622645830802852805
- Author
- Schneider M
- Muller T
- Haberli A
- Hornung M
- Baltes H
- Publication year
- Publication venue
- Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots
External Links
Snippet
A novel technology for the fabrication of thermally, electrically, and mechanically decoupled n-doped silicon microstructures is presented. The n-silicon may contain p-well regions and, therefore, unrestricted CMOS circuitry and transducers. Furthermore, the technology enables …
- 229910052710 silicon 0 abstract description 24
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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