[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Cho et al., 2021 - Google Patents

Universal Patterning for 2D Van der Waals Materials via Direct Optical Lithography

Cho et al., 2021

View PDF
Document ID
11407359453840201783
Author
Cho S
Ahn S
Lee S
Ha H
Kim T
Jo M
Song C
Im T
Rani P
Gyeon M
Cho K
Song S
Jang M
Cho Y
Lee K
Kang K
Publication year
Publication venue
Advanced Functional Materials

External Links

Snippet

Advanced patterning techniques are essential to pursue applications of 2D van der Waals (vdW) materials in electrical and optical devices. Here, the direct optical lithography (DOL) of vdW materials by single‐pulse irradiation of high‐power light through a photomask is …
Continue reading at janglab.org (PDF) (other versions)

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0014Processes specially adapted for the manufacture or treatment of devices or of parts thereof for changing the shape of the device layer, e.g. patterning

Similar Documents

Publication Publication Date Title
Liang et al. Impact of post‐lithography polymer residue on the electrical characteristics of MoS2 and WSe2 field effect transistors
Hallam et al. Strain, bubbles, dirt, and folds: a study of graphene Polymer‐Assisted transfer
JP4784646B2 (en) Processed substrate having hydrophilic region and water-repellent region and method for producing the same
WO2010113744A1 (en) Agent for removing conductive film and method for removing conductive film
Kang et al. Microelectrode fabrication by laser direct curing of tiny nanoparticle self-generated from organometallic ink
Smits et al. Laser induced forward transfer of graphene
Liang et al. High‐Resolution Patterning of 2D Perovskite Films through Femtosecond Laser Direct Writing
Zhao et al. Scanning probe lithography patterning of monolayer semiconductors and application in quantifying edge recombination
Chen et al. Sublimation-assisted graphene transfer technique based on small polyaromatic hydrocarbons
Cho et al. Universal Patterning for 2D Van der Waals Materials via Direct Optical Lithography
Howard et al. Improving the performance of high-laser-damage-threshold, multilayer dielectric pulse-compression gratings through low-temperature chemical cleaning
Sul et al. Reduction of hole doping of chemical vapor deposition grown graphene by photoresist selection and thermal treatment
Kim et al. Novel patterning of flexible and transparent Ag nanowire electrodes using oxygen plasma treatment
Han et al. Hierarchically Ordered Perovskites with High Photo‐Electronic and Environmental Stability via Nanoimprinting Guided Block Copolymer Self‐Assembly
Nath et al. In search of quantum-limited contact resistance: understanding the intrinsic and extrinsic effects on the graphene–metal interface
Kurra et al. Ultrafast direct ablative patterning of HOPG by single laser pulses to produce graphene ribbons
Park et al. Photothermally Crumpled MoS2 Film as an Omnidirectionally Stretchable Platform
Mitchell et al. Laser direct write of silicon nanowires
Rho et al. Laser‐Assisted Thermomechanical Thinning of MoTe2 in Nanoscale Lateral Resolution
Schröter et al. Substrate-mediated effects in photothermal patterning of alkanethiol self-assembled monolayers with microfocused continuous-wave lasers
Donie et al. A Self‐Assembly Method for Tunable and Scalable Nano‐Stamps: A Versatile Approach for Imprinting Nanostructures
Han et al. Effect of UV irradiation and heat treatment on the surface potential distribution of monolayer WS2 on SiO2/Si and Au substrates
Brunner et al. Fully Additive Electrohydrodynamic Inkjet‐Printed TiO2 Mid‐Infrared Meta‐Optics
Wen et al. Helium Ion‐Assisted Wet Etching of Silicon Carbide with Extremely Low Roughness for High‐Quality Nanofabrication
Grützmacher et al. Local Manipulation of the Energy Levels of 2D TMDCs on the Microscale Level via Microprinted Self‐Assembled Monolayers