Shiravand et al., 2014 - Google Patents
Influence of the isothermal cure temperature on the nanostructure and thermal properties of an epoxy layered silicate nanocompositeShiravand et al., 2014
- Document ID
- 10909686914136228776
- Author
- Shiravand F
- Hutchinson J
- Calventus Y
- Publication year
- Publication venue
- Polymer Engineering & Science
External Links
Snippet
The cure kinetics of triglycidyl p‐amino phenol (TGAP) epoxy resin with a diamine (4, 4‐ diamino diphenyl sulphone [DDS]), reinforced with montmorillonite (MMT), has been studied by differential scanning calorimetry. The isothermal cure reaction consists of two parts: a …
- 239000002114 nanocomposite 0 title abstract description 23
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
- C08K3/00—Use of inorganic ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
- C08K3/00—Use of inorganic ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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