[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Ma et al., 2020 - Google Patents

A three-dimensional boundary-dependent compact thermal network model for IGBT modules in new energy vehicles

Ma et al., 2020

Document ID
1037400421467553583
Author
Ma M
Guo W
Yan X
Yang S
Zhang X
Chen W
Cai G
Publication year
Publication venue
IEEE Transactions on Industrial Electronics

External Links

Snippet

With the development of power electronics technology, power modules delivery considerably greater power density, which makes junction temperature an important parameter for reliable operation. Existing thermal models often ignore the influence of the …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring, busbar connections
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Similar Documents

Publication Publication Date Title
Ma et al. A three-dimensional boundary-dependent compact thermal network model for IGBT modules in new energy vehicles
Bahman et al. A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules
Bahman et al. A 3-D-lumped thermal network model for long-term load profiles analysis in high-power IGBT modules
Zhang et al. Simplified thermal modeling for IGBT modules with periodic power loss profiles in modular multilevel converters
Baker et al. Improved reliability of power modules: A review of online junction temperature measurement methods
Choi et al. Advanced accelerated power cycling test for reliability investigation of power device modules
Ye et al. A fast electro-thermal model of traction inverters for electrified vehicles
Batard et al. Lumped dynamic electrothermal model of IGBT module of inverters
Li et al. Thermoelectric cooling for power electronics circuits: Modeling and active temperature control
Ouhab et al. New analytical model for real-time junction temperature estimation of multichip power module used in a motor drive
Ghimire et al. A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application
Wang et al. An online frequency-domain junction temperature estimation method for IGBT modules
Ning et al. Power module and cooling system thermal performance evaluation for HEV application
Chen et al. Electrothermal-based junction temperature estimation model for converter of switched reluctance motor drive system
Li et al. Improved thermal couple impedance model and thermal analysis of multi-chip paralleled IGBT module
Guo et al. Real-time average junction temperature estimation for multichip IGBT modules with low computational cost
Yang et al. Transient electro-thermal analysis for a MOSFET based traction inverter
Zhou et al. Thermal profile analysis of doubly-fed induction generator based wind power converter with air and liquid cooling methods
Bahman et al. A novel 3D thermal impedance model for high power modules considering multi-layer thermal coupling and different heating/cooling conditions
Ma et al. Online junction temperature estimation using integrated NTC thermistor in IGBT modules for PMSM drives
Acharya et al. Thermal performance evaluation of a 1.7-kV, 450-A SiC-MOSFET based modular three-phase power block with wide fundamental frequency operations
Wang et al. Simplified estimation of junction temperature fluctuation at the fundamental frequency for IGBT modules considering mission profile
Chen et al. Predicting IGBT junction temperature with thermal network component model
Wei et al. Modeling and analysis of thermal resistances and thermal coupling between power devices
Islam et al. Power loss and thermal impedance modeling of multilevel power converter with discontinuous modulation