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Leung, 2018 - Google Patents

Thermally conductive polymer composites and nanocomposites: Processing-structure-property relationships

Leung, 2018

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Document ID
10264866975741402330
Author
Leung S
Publication year
Publication venue
Composites Part B: Engineering

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Rapid fabricating technology advancement in the computing and electronic industries has led to new challenges in thermal management of electronics. As significantly more components are being packed in a smaller footprint in micro-and-nano-electronics, the …
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