[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Jiang et al., 2007 - Google Patents

A novel method for nanoprecision alignment in wafer bonding applications

Jiang et al., 2007

View PDF
Document ID
9782471269001232208
Author
Jiang L
Pandraud G
French P
Spearing S
Kraft M
Publication year
Publication venue
Journal of Micromechanics and Microengineering

External Links

Snippet

Wafer bonding has been identified as a promising technique to enable fabrication of many advanced semiconductor devices such as three-dimensional integrated circuits (3D IC) and micro/nano systems. However, with the device dimensions already in the nanometre range …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICRO-STRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICRO-STRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICRO-STRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing micro-systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICRO-STRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of micro-structural devices or systems
    • B81C2201/01—Manufacture or treatment of micro-structural devices or systems in or on a substrate
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Similar Documents

Publication Publication Date Title
Enikov et al. Three-dimensional microfabrication for a multi-degree-of-freedom capacitive force sensor using fibre-chip coupling
Despont et al. Wafer-scale microdevice transfer/interconnect: Its application in an AFM-based data-storage system
Klaassen et al. Silicon fusion bonding and deep reactive ion etching a new technology for microstructures
TW502003B (en) Combination horizontal and vertical thermal actuator
JP6063475B2 (en) Wafer level capping of MEMS devices suitable for packaging
US6808952B1 (en) Process for fabricating a microelectromechanical structure
KR20030067665A (en) Direct acting vertical thermal actuator with controlled bending
Jiang et al. A novel method for nanoprecision alignment in wafer bonding applications
US20060186874A1 (en) System and method for mechanical testing of freestanding microscale to nanoscale thin films
Han et al. Micromechanical velcro
Kim et al. Microfabricated torsional actuators using self-aligned plastic deformation of silicon
Carlen et al. High-aspect ratio vertical comb-drive actuator with small self-aligned finger gaps
Weigold et al. Fabrication of thick Si resonators with a frontside-release etch-diffusion process
Cunningham et al. Wafer bonding
Kawashima et al. High-precision alignment and bonding system for the fabrication of 3-D nanostructures
US7981303B2 (en) Method of manufacturing monocrystalline silicon micromirrors
Phinney et al. Thermal microactuators
Gilgunn et al. Flip-chip integrated SOI-CMOS-MEMS fabrication technology
Lee et al. Fine keyed alignment and bonding for wafer-level 3D ICs
Hofmann et al. Monolithic three-dimensional single-crystal silicon microelectromechanical systems
Jiang et al. Wafer bonding with nanoprecision alignment for micro/nano systems
Jung et al. Fabrication of 3D comb drive microscanners by mechanically induced permanent displacement
Lee Reliability and failure analysis of MEMS/NEMS switches
Sasaki et al. Tunable vertical comb for driving micromirror realized by bending device wafer
Gaspar et al. Mechanical characterization of silicon nitride thin-films using microtensile specimens with integrated 2D diffraction gratings