Yeh et al., 2015 - Google Patents
Sputter epitaxy of heavily doped p+/n+ Ge film on Si (100) by cosputtering with Al/Sb for solar cell applicationYeh et al., 2015
- Document ID
- 9755937715842152587
- Author
- Yeh W
- Matsumoto A
- Sugihara K
- Publication year
- Publication venue
- Japanese Journal of Applied Physics
External Links
Snippet
Heavily doped p+ or n+ Ge films were grown on Si substrates by sputter epitaxy. Ge was cosputtered with Al or Sb to add dopant impurities. The maximum carrier densities were 1.0× 10 21 for p-type films and 8.4× 10 19 cm− 3 for n-type films. The activation ratio of Sb was …
- 238000000407 epitaxy 0 title abstract description 10
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02562—Tellurides
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies; Multistep manufacturing processes therefor characterised by the materials of which they are formed
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GASES [GHG] EMISSION, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/54—Material technologies
- Y02E10/543—Solar cells from Group II-VI materials
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Lee et al. | Homoepitaxial growth of beta gallium oxide films by mist chemical vapor deposition | |
Zheng et al. | Growth of crystalline Ge1− xSnx films on Si (100) by magnetron sputtering | |
Hirukawa et al. | Isochronal annealing study of Mg-implanted p-type GaN activated by ultra-high-pressure annealing | |
Kim et al. | Comparison of AlGaN p–i–n ultraviolet avalanche photodiodes grown on free-standing GaN and sapphire substrates | |
Kwoen et al. | Elimination of anti-phase boundaries in a GaAs layer directly-grown on an on-axis Si (001) substrate by optimizing an AlGaAs nucleation layer | |
Kopytko et al. | Minority carrier lifetime in HgCdTe (100) epilayers and their potential application to background radiation limited MWIR photodiodes | |
Takeuchi et al. | Characterization of shallow-and deep-level defects in undoped Ge1− xSnx epitaxial layers by electrical measurements | |
Yamamoto et al. | Ge/SiGe multiple quantum well fabrication by reduced-pressure chemical vapor deposition | |
Alam et al. | Critical thickness of strained Si1-xGex on Ge (111) and Ge-on-Si (111) | |
Liu et al. | Growth of relaxed GeSn film with high Sn content via Sn component-grade buffer layer structure | |
Luong et al. | Making germanium, an indirect band gap semiconductor, suitable for light-emitting devices | |
Yeh et al. | Sputter epitaxial growth of flat germanium film with low threading-dislocation density on silicon (001) | |
Haku et al. | Effect of post-annealing on the significant photoresponsivity enhancement of BaSi2 epitaxial films on Si (111) | |
Kondratenko et al. | Impact of defects on photoexcited carrier relaxation dynamics in GeSn thin films | |
Wang et al. | Germanium–tin interdiffusion in strained Ge/GeSn multiple-quantum-well structure | |
Liu et al. | Dislocation-related photoluminescence of GeSn films grown on Ge (001) substrates by molecular beam epitaxy | |
Danno et al. | Large critical field of Li-doped NiO investigated by p+-NiO/n+-Ga2O3 heterojunction diodes | |
Cai et al. | Enhanced Si–Ge interdiffusion in high phosphorus-doped germanium on silicon | |
Zhang et al. | Diffusion coefficients of impurity atoms in BaSi2 epitaxial films grown by molecular beam epitaxy | |
Benyahia et al. | Investigation on the InAs1–xSbx epilayers growth on GaAs (001) substrate by molecular beam epitaxy | |
Aonuki et al. | Fabrication of As-doped n-type BaSi2 epitaxial films grown by molecular beam epitaxy | |
Moriyama et al. | In situ doped epitaxial growth of highly dopant-activated n+-Ge layers for reduction of parasitic resistance in Ge-nMISFETs | |
Dev et al. | Wafer-scale mono-crystalline GeSn alloy on Ge by sputtering and solid phase epitaxy | |
Yeh et al. | Sputter epitaxy of heavily doped p+/n+ Ge film on Si (100) by cosputtering with Al/Sb for solar cell application | |
Kurosawa et al. | Synthesis of heavily Ga-doped Si1− xSnx/Si heterostructures and their valence-band-offset determination |