Johns, 1995 - Google Patents
Diffusion bonding process using silver-germanium alloys and a silver-germanium alloy for use in the methodJohns, 1995
- Document ID
- 8944305556861063654
- Author
- Johns P
- Publication year
- Publication venue
- Patent NumberGB 2283934
External Links
- 238000009792 diffusion process 0 title abstract description 4
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6168071B1 (en) | Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method | |
| WO1995035181A3 (en) | Joining of metals using a bulk amorphous intermediate layer | |
| JPH07226416A (en) | Semiconductor chip package and its preparation | |
| CA2155091A1 (en) | Bonding material and bonding method for electric element | |
| GB2197235A (en) | Multiple foil transient liquid phase bonding | |
| CA2176919A1 (en) | A method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method | |
| Johns | Diffusion bonding process using silver-germanium alloys and a silver-germanium alloy for use in the method | |
| RU96113125A (en) | METHOD OF COMBINING TOGETHER MATERIALS BY DIFFUSION PROCESS USING SILVER-GERMANIUM ALLOYS AND SILVER-GERMANIUM ALLOY FOR USE IN THIS METHOD | |
| CA2394136A1 (en) | Bonded products and methods of fabrication therefor | |
| Johns | A method of joining materials together by a diffusion process using silver-germanium alloys | |
| GB2283934A (en) | Diffusion bonding process using silver/germanium alloys and a silver germanium alloy for use in the method | |
| JPS60169534A (en) | Composite cu-c fiber material with cu foil containing non-ferrous metal | |
| JPS6418245A (en) | Ceramic substrate having metal pin and its manufacture | |
| Lesgourgues | Diffusion Brazing Process for Pieces of Superalloys | |
| JPH0787065B2 (en) | Temperature fuse mechanism | |
| Warashina et al. | Thermal fatigue damage of quad flat pack leads and Sn-3.5 Ag-X (X= Bi and Cu) solder joints | |
| JPS6427233A (en) | Pellet for junction | |
| Akyurek | Bonding Process for Two Metal Plates | |
| Kalimullin et al. | Effect of Laser Heat Treatment on Creep of MA 21 Alloy | |
| JPS6418559A (en) | Integrating method for different kinds of metal | |
| JPS55106672A (en) | Brazing method in oxydation-free atmosphere | |
| Fujimori et al. | The Application of Low Melting Cu-P System Alloy as a Bonding Material for Diamond Sintered Tools | |
| Kufaikin | Allowable saturation of solder melt by copper during soldering superconducting wire | |
| Bampton | Method for Diffusion Bonding Aluminum | |
| Klimpel et al. | The use of lead-cadmium alloys to solder galvanized steel |