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Long et al., 2019 - Google Patents

Si-based Hybrid Micro-cooler Fabrication Process Development

Long et al., 2019

Document ID
8878210657937266216
Author
Long L
Yong H
Xiaowu Z
Publication year
Publication venue
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

External Links

Snippet

In this paper, silicon substrate wafer level fabrication process of liquid cooling microchannel is introduced. Fig. 1 shows the microchannels fabricated on the silicon wafer surface. This microchannel component is to be integrated into a heat sink package served as an advance …
Continue reading at ieeexplore.ieee.org (other versions)

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