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Yao et al., 2022 - Google Patents

An investigation on application potentiality of microstructure heat sinks with different flow topological morphology

Yao et al., 2022

Document ID
8598092449314930468
Author
Yao X
Shi Q
Liu Q
Qin L
Ju X
Xu C
Publication year
Publication venue
Science China Technological Sciences

External Links

Snippet

Microstructure heat sinks have great potential for high heat flux cooling. In this paper, we compared microchannel (MC), micro-pin-fin (MPF), manifold microchannel (MMC), and manifold micro-pin-fin (MMPF) heat sinks to figure out the pros and cons. Fluid flow and …
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