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Zeng et al., 2017 - Google Patents

Effect of radiation on reliability of through-Silicon via for 3-D packaging systems

Zeng et al., 2017

Document ID
847463744505164717
Author
Zeng Q
Chen J
Jin Y
Publication year
Publication venue
IEEE Transactions on Device and Materials Reliability

External Links

Snippet

In this paper, radiation reliability of through-silicon via (TSV) was studied experimentally. Characterization of leakage current between adjacent TSVs and capacitance of an array of TSVs was used to evaluate the effects of radiation on reliability of TSVs. All samples were …
Continue reading at ieeexplore.ieee.org (other versions)

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