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Shealy et al., 2002 - Google Patents

Gallium nitride (GaN) HEMT's: progress and potential for commercial applications

Shealy et al., 2002

Document ID
804376405742743325
Author
Shealy J
Smart J
Poulton M
Sadler R
Grider D
Gibb S
Hosse B
Sousa B
Halchin D
Steel V
Garber P
Wilkerson P
Zaroff B
Dick J
Mercier T
Bonaker J
Hamilton M
Greer C
Isenhour M
Publication year
Publication venue
24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu

External Links

Snippet

Gallium nitride (GaN) HEMT's: progress and potential for commercial applications Page 1 Gallium Nitride (GaN) HEMT's: Progress and Potential for Commercial Applications J. Shealy, J. Smart, M. Poulton, R. Sadler, D. Grider, S. Gibb, B. Hosse, B. Sousa, D. Halchin, V. Steel, P …
Continue reading at ieeexplore.ieee.org (other versions)

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    • H01L29/66Types of semiconductor device; Multistep manufacturing processes therefor
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    • H01L29/66Types of semiconductor device; Multistep manufacturing processes therefor
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    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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    • H01L29/66446Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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    • H01L29/02Semiconductor bodies; Multistep manufacturing processes therefor
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