[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Lee et al., 2002 - Google Patents

Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5 Ag-0.75 Cu solder

Lee et al., 2002

View PDF
Document ID
8005450884329502411
Author
Lee C
Jung S
Shin Y
Shur C
Publication year
Publication venue
Materials Transactions

External Links

Snippet

Compared to more conventional packages, such as the dual-in line package or the quad-flat- pack package, the ballgrid array (BGA) package has the advantages of having higher input/output terminal density, smaller footprint, and higher reliability. 1–3) The BGA package …
Continue reading at www.jstage.jst.go.jp (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions ; Methods of application thereof
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys

Similar Documents

Publication Publication Date Title
Lee et al. Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5 Ag-0.75 Cu solder
Subramanian et al. Rare-earth additions to lead-free electronic solders
Ren et al. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections
US6231691B1 (en) Lead-free solder
KR100412765B1 (en) Solder material, device and manufacturing method thereof using the same solder material
JP5147409B2 (en) Solder alloy
Wu et al. Properties of lead-free solder alloys with rare earth element additions
Lee et al. Intermetallic compound layer formation between Sn–3.5 mass% Ag BGA solder ball and (Cu, immersion Au/electroless Ni–P/Cu) substrate
Huang et al. Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 C
CN107635716B (en) High reliability lead-free solder alloys for harsh environment electronic device applications
Nishiura et al. Mechanical strength and microstructure of BGA joints using lead-free solders
Lee et al. Effect of surface finishes on ball shear strength in BGA joints with Sn-3.5 mass% Ag solder
Young et al. Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing
Sun et al. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni (P) immersion Au surface finish after reflow soldering
Nishikawa et al. Interfacial reaction between Sn–Ag–Co solder and metals
Subramanian et al. Physical metallurgy in lead-free electronic solder development
Choquette Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections
JP6887183B1 (en) Solder alloys and molded solders
Yoon et al. Mechanical reliability of Sn-Ag BGA solder joints with various electroless Ni-P and Ni-B plating layers
Li et al. The formation and evolution of IMC and its effect on the solder joint properties
Nishikawa et al. Effect of Ni or Co addition to Sn-Ag solder on microstructure and joint strength at interface
Xia et al. Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging
Mei et al. Microstructual evolution and interfacial interaction in lead-free solder interconnects
Hillman et al. Intermetallic Compounds in Solder Alloys: Common Misconceptions
JP2004330259A (en) LEAD-FREE SnCu SOLDER ALLOY