[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Liu et al., 2006 - Google Patents

Epoxy/polyhedral oligomeric silsesquioxane nanocomposites from octakis (glycidyldimethylsiloxy) octasilsesquioxane and small‐molecule curing agents

Liu et al., 2006

View PDF
Document ID
7835461715005250845
Author
Liu Y
Chang G
Hsu K
Chang F
Publication year
Publication venue
Journal of Polymer Science Part A: Polymer Chemistry

External Links

Snippet

Epoxy/polyhedral oligomeric silsesquioxane (POSS) nanocomposites were obtained from octakis (glycidyldimethylsiloxy) octasilsesquioxane (OG) and diglycidyl ether of bisphenol A cured with small‐molecule curing agents of diethylphosphite (DEP) and dicyandiamide …
Continue reading at ir.lib.nycu.edu.tw (PDF) (other versions)

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K3/00Use of inorganic ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K5/00Use of organic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G

Similar Documents

Publication Publication Date Title
Liu et al. Epoxy/polyhedral oligomeric silsesquioxane nanocomposites from octakis (glycidyldimethylsiloxy) octasilsesquioxane and small‐molecule curing agents
Yang et al. Effect of borates on thermal degradation and flame retardancy of epoxy resins using polyhedral oligomeric silsesquioxane as a curing agent
Zhuo et al. Flame retardancy and flame retarding mechanism of high performance hyperbranched polysiloxane modified bismaleimide/cyanate ester resin
Satdive et al. Phosphorus-and silicon-containing amino curing agent for epoxy resin
Wang et al. Achieving ultrahigh glass transition temperature, halogen-free and phosphorus-free intrinsic flame retardancy for bismaleimide resin through building network with diallyloxydiphenyldisulfide
Liu et al. 9, 10-Dihydro-9-oxa-10-phosphaphenanthrene 10-oxide-based oligosiloxane as a promising damping additive for methyl vinyl silicone rubber (VMQ)
Fan et al. Flame-retardant polyimide cross-linked with polyhedral oligomeric octa (aminophenyl) silsesquioxane
Liu et al. The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer
Machado et al. Very high-char-yielding elastomers based on the copolymers of a catechol/furfurylamine benzoxazine and polydimethylsiloxane oligomers
Krishnadevi et al. Development of cyclophosphazene and rice husk ash incorporated epoxy composites for high performance applications
Zhang et al. Suppression effect and mechanism of amine-containing MQ silicone resin on the tracking and erosion resistance of silicone rubber
Bao et al. Synergistic effect of methyl phenyl silicone resin and DOPO on the flame retardancy of epoxy resins
Liu et al. Polymerization and nanocomposites properties of multifunctional methylmethacrylate POSS
George et al. Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems
Doley et al. In situ development of bio‐based polyurethane‐blend‐epoxy hybrid materials and their nanocomposites with modified graphene oxide via non‐isocyanate route
Liu et al. Novel approach to preparing epoxy/polyhedral oligometric silsesquioxane hybrid materials possessing high mass fractions of polyhedral oligometric silsesquioxane and good homogeneity
Ma et al. High-performance, multi-functional and well-dispersed graphene/epoxy nanocomposites via internal antiplasticization and π-πF interactions
Fang et al. Cyclotriphophazene-centered six-arm eugenol-linked low-dielectric materials with high thermostability and transparency
Jiang et al. Sol–gel synthesis and enhanced properties of a novel transparent PMMA based organic–inorganic hybrid containing phosphorus, nitrogen and silicon
Gui et al. Preparation and characterization of liquid crystalline polyurethane‐imide modified epoxy resin composites
Huang et al. Preparation and characterization of epoxy/polyhedral oligomeric silsesquioxane hybrid nanocomposites
Tang et al. Effects of novel polyhedral oligomeric silsesquioxane containing hydroxyl group and epoxy group on the dicyclopentadiene bisphenol dicyanate ester composites
Zhao et al. Preparation and properties of halogen‐free flame‐retarded phthalonitrile–epoxy blends
Wang et al. Novel epoxy nanocomposite of low Dk introduced fluorine‐containing POSS structure
Surender et al. Model free kinetics—Thermal degradation of bisphenol A based polybismaleimide–cloisite 15a nanocomposites