Rodriguez et al., 2012 - Google Patents
Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive ManufacturingRodriguez et al., 2012
View PDF- Document ID
- 7824074760702701124
- Author
- Rodriguez R
- Church K
- Chen X
- Publication year
- Publication venue
- International Symposium on Microelectronics
External Links
Snippet
Next generation electronics will not change drastically in function; batteries will last longer, devices will have more functions and devices will take unique shapes, but for the next several years, electronics will travel the path it has been traveling for a couple of decades …
- 238000004519 manufacturing process 0 title abstract description 12
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/0051—Rapid manufacturing and prototyping of 3D objects by additive depositing, agglomerating or laminating of plastics material, e.g. by stereolithography or selective laser sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infra-red radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F3/1055—Selective sintering, i.e. stereolithography
- B22F2003/1056—Apparatus components, details or accessories
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