Park et al., 2002 - Google Patents
Surface modification of tetrafluoroethylene–hexafluoropropylene (FEP) copolymer by remote H2, N2, O2, and Ar plasmasPark et al., 2002
- Document ID
- 7672945959700117348
- Author
- Park Y
- Tasaka S
- Inagaki N
- Publication year
- Publication venue
- Journal of applied polymer science
External Links
Snippet
Tetrafluoroethylene–hexafluoropropylene (FEP) copolymer sheets were modified by remote H2, N2, O2, and Ar plasmas, and the effects of the modification on adhesion between FEP sheets and copper metal were investigated. The four plasmas were able to modify the FEP …
- 229920002068 Fluorinated ethylene propylene 0 title abstract description 131
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Park et al. | Surface modification of tetrafluoroethylene–hexafluoropropylene (FEP) copolymer by remote H2, N2, O2, and Ar plasmas | |
| Inagaki et al. | Effects of surface modification by remote hydrogen plasma on adhesion in poly (tetrafluoroethylene)/copper composites | |
| Inagaki et al. | Surface characterization of plasma‐modified poly (ethylene terephthalate) film surfaces | |
| Inagaki et al. | Improved adhesion between Kapton film and copper metal by plasma graft polymerization of vinylimidazole | |
| Kim | Surface modification of poly (tetrafluoroethylene) film by chemical etching, plasma, and ion beam treatments | |
| Shi | Recent advances in polymer thin films prepared by plasma polymerization synthesis, structural characterization, properties and applications | |
| KR100494050B1 (en) | Plating method of metal film on the surface of polymer | |
| Hubert et al. | Etching processes of polytetrafluoroethylene surfaces exposed to He and He–O2 atmospheric post-discharges | |
| Zhang et al. | Atmospheric-pressure plasma jet deposition of bumpy coating improves polypropylene surface flashover performance in vacuum | |
| Yu et al. | Amidoximation of the acrylonitrile polymer grafted on poly (tetrafluoroethylene-co-hexafluoropropylene) films and its relevance to the electroless plating of copper | |
| Inagaki et al. | Surface Modification of Tetrafluoroethylene− Perfluoroalkyl Vinyl Ether Copolymer (PFA) by Remote Hydrogen Plasma and Surface Metallization with Electroless Plating of Copper Metal | |
| Zhang et al. | Deposition of fluoropolymer films on Si (100) surfaces by Rf magnetron sputtering of poly (tetrafluoroethylene) | |
| Park et al. | A new approach for selective surface modification of fluoropolymers by remote plasmas | |
| Inagaki et al. | Surface modification of poly (tetrafluoroethylene) with pulsed hydrogen plasma | |
| Zettsu et al. | Surface functionalization of PTFE sheet through atmospheric pressure plasma liquid deposition approach | |
| Yu et al. | Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole | |
| Inagaki et al. | Surface modification of polyimide film surface by silane coupling reactions for copper metallization | |
| Han et al. | Surface reaction on polyvinylidenefluoride (PVDF) irradiated by low energy ion beam in reactive gas environment | |
| Inagaki et al. | Surface modification of tetrafluoroethylene–perfluoroalkyl vinylether copolymer (PFA) by plasmas for copper metallization | |
| Inagaki et al. | Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide | |
| Kogoma et al. | Low-temperature atmospheric discharge plasma and its applications for the surface treatment | |
| Inagaki et al. | Improved adhesion between Kapton film and copper metal by silane‐coupling reactions | |
| Inagaki et al. | Effects of the surface modification by remote hydrogen plasma on adhesion in the electroless copper/tetrafluoroethylene-hexafluoropropylene copolymer (FEP) system | |
| Lee et al. | Adhesion improvement of polyimide/metal interface by He/O2/NF3 atmospheric pressure plasma | |
| Inagaki et al. | Surface modification of ethylene‐co‐tetrafluoroethylene films by remote plasmas |