Tiwari et al., 2021 - Google Patents
Butt-coupled III-V photodetector monolithically integrated on soi with data reception at 50 Gbps OOKTiwari et al., 2021
- Document ID
- 7580774412249754581
- Author
- Tiwari P
- Wen P
- Mauthe S
- Baumann M
- Bitachon B
- Schmid H
- Leuthold J
- Moselund K
- Publication year
- Publication venue
- 2021 Optical Fiber Communications Conference and Exhibition (OFC)
External Links
Snippet
Butt-Coupled III-V Photodetector Monolithically Integrated on SOI with data reception at 50 Gbps
OOK Page 1 Butt-Coupled III-V Photodetector Monolithically Integrated on SOI with data
reception at 50 Gbps OOK Preksha Tiwari1, Pengyan Wen1, Svenja Mauthe1,+, Michael …
- 230000005540 biological transmission 0 description 7
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infra-red, visible or ultra-violet radiation
- H01L31/102—Devices sensitive to infra-red, visible or ultra-violet radiation characterised by only one potential barrier or surface barrier
- H01L31/105—Devices sensitive to infra-red, visible or ultra-violet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
- H04B10/69—Electrical arrangements in the receiver
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. alGaAs-laser, InP-based laser
- H01S5/3235—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. alGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10274687B1 (en) | Highly integrated multi-channel optical transceiver module and active optical cable based on silicon photonic chip | |
Nada et al. | Responsivity-bandwidth limit of avalanche photodiodes: toward future ethernet systems | |
Benedikovic et al. | Comprehensive study on chip-integrated germanium pin photodetectors for energy-efficient silicon interconnects | |
Nada et al. | A 42-GHz bandwidth avalanche photodiodes based on III-V compounds for 106-Gbit/s PAM4 applications | |
Sato et al. | Photonic crystal lasers for chip-to-chip and on-chip optical interconnects | |
Nada et al. | Design and performance of high-speed avalanche photodiodes for 100-Gb/s systems and beyond | |
Baumgartner et al. | High-speed CMOS-compatible III-V on Si membrane photodetectors | |
Benedikovic et al. | Silicon-germanium avalanche receivers with fJ/bit energy consumption | |
Xie et al. | InGaAs/InAlAs avalanche photodiode with low dark current for high-speed operation | |
Nakajima et al. | High-speed avalanche photodiode and high-sensitivity receiver optical subassembly for 100-Gb/s ethernet | |
Tiwari et al. | Butt-coupled III-V photodetector monolithically integrated on soi with data reception at 50 Gbps OOK | |
Mauthe et al. | Ultra-thin III-V photodetectors epitaxially integrated on si with bandwidth exceeding 25 GHz | |
Cheng et al. | 40-Gb/s low chirp electroabsorption modulator integrated with DFB laser | |
Baumgartner et al. | Novel CMOS-compatible ultralow capacitance hybrid III-V/Si photodetectors tested up to 32 Gbps NRZ | |
Kwon et al. | Fabrication of 40 Gb/s Front‐End Optical Receivers Using Spot‐Size Converter Integrated Waveguide Photodiodes | |
Sun et al. | Evanescently coupled waveguide InGaAs UTC-PD having an over 21 GHz bandwidth under zero bias | |
Takahata et al. | 46.5-GHz-bandwidth monolithic receiver OEIC consisting of a waveguide pin photodiode and a HEMT distributed amplifier | |
Takahata et al. | Ultrafast monolithic receiver OEIC composed of multimode waveguide pin photodiode and HEMT distributed amplifier | |
Demiguel et al. | Analysis of partially depleted absorber waveguide photodiodes | |
Long et al. | High-Speed 46-GHz 850 nm Photodetector With Inductive Peaking | |
Beckerwerth et al. | High-Speed Photodiodes for Power Efficient Data Transmission | |
Okumura et al. | Lateral junction waveguide-type photodiode grown on semi-insulating InP substrate | |
Zhang et al. | High speed waveguide uni-traveling carrier InGaAs/InP photodiodes fabricated by Zn diffusion doping | |
Matsuo | Heterogeneously integrated III–V photonic devices on Si | |
JP2003043430A (en) | Optical transmitting apparatus and manufacturing method thereof |