[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Holmes et al., 2016 - Google Patents

Spin-splitting in p-type Ge devices

Holmes et al., 2016

View PDF
Document ID
7517647842613766756
Author
Holmes S
Newton P
Llandro J
Mansell R
Barnes C
Morrison C
Myronov M
Publication year
Publication venue
Journal of Applied Physics

External Links

Snippet

Compressively strained Ge quantum well devices have a spin-splitting in applied magnetic field that is entirely consistent with a Zeeman effect in the heavy hole valence band. The spin orientation is determined by the biaxial strain in the quantum well with the relaxed SiGe …
Continue reading at warwick.ac.uk (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions; characterised by the concentration or distribution of impurities within semiconductor regions
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies; Multistep manufacturing processes therefor
    • H01L29/36Semiconductor bodies; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
    • H01L29/365Planar doping, e.g. atomic-plane doping, delta-doping
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L43/00Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof

Similar Documents

Publication Publication Date Title
Sammak et al. Shallow and undoped germanium quantum wells: a playground for spin and hybrid quantum technology
Vaitiekėnas et al. Zero-bias peaks at zero magnetic field in ferromagnetic hybrid nanowires
Li et al. Controlling many-body states by the electric-field effect in a two-dimensional material
Morrison et al. Observation of Rashba zero-field spin splitting in a strained germanium 2D hole gas
Vinzelberg et al. Low temperature tunneling magnetoresistance on (La, Sr) MnO3∕ Co junctions with organic spacer layers
Matzen et al. Structure, magnetic ordering, and spin filtering efficiency of NiFe2O4 (111) ultrathin films
Chen et al. Electric-field control of interfacial spin–orbit fields
Yoshizumi et al. Gate-controlled switching between persistent and inverse persistent spin helix states
Ranga et al. Delta-doped β-Ga2O3 films with narrow FWHM grown by metalorganic vapor-phase epitaxy
Myronov et al. Holes outperform electrons in group IV semiconductor materials
Le Anh et al. Control of ferromagnetism by manipulating the carrier wavefunction in ferromagnetic semiconductor (In, Fe) As quantum wells
Degli Esposti et al. Wafer-scale low-disorder 2DEG in 28Si/SiGe without an epitaxial Si cap
Li et al. Room‐Temperature Gate‐Tunable Nonreciprocal Charge Transport in Lattice‐Matched InSb/CdTe Heterostructures
Melnikov et al. Unusual anisotropy of inplane field magnetoresistance in ultra-high mobility SiGe/Si/SiGe quantum wells
Holmes et al. Spin-splitting in p-type Ge devices
Ashlea Alava et al. High electron mobility and low noise quantum point contacts in an ultra-shallow all-epitaxial metal gate GaAs/AlxGa1− xAs heterostructure
Vervaeke et al. Size dependence of microscopic Hall sensor detection limits
Habib et al. Negative differential Rashba effect in two-dimensional hole systems
Ishihara et al. A strong anisotropy of spin dephasing time of quasi-one dimensional electron gas in modulation-doped GaAs/AlGaAs wires
Nitta et al. Electrical manipulation of spins in the Rashba two dimensional electron gas systems
Buchholz et al. Nonlocal Aharonov–Bohm conductance oscillations in an asymmetric quantum ring
Gilbertson et al. Sub-100-nm negative bend resistance ballistic sensors for high spatial resolution magnetic field detection
Huang et al. Measurement of work function difference between Pb/Si (111) and Pb/Ge/Si (111) by high-order Gundlach oscillation
Chenaud et al. Sensitivity and noise of micro-Hall magnetic sensors based on InGaAs quantum wells
Fan et al. Measurements of spin–orbit interaction in epitaxially grown InAs nanosheets