Takahashi et al., 2011 - Google Patents
Carbon nanotube active-matrix backplanes for conformal electronics and sensorsTakahashi et al., 2011
View PDF- Document ID
- 6946131316503832510
- Author
- Takahashi T
- Takei K
- Gillies A
- Fearing R
- Javey A
- Publication year
- Publication venue
- Nano letters
External Links
Snippet
In this paper, we report a promising approach for fabricating large-scale flexible and stretchable electronics using a semiconductor-enriched carbon nanotube solution. Uniform semiconducting nanotube networks with superb electrical properties (mobility of∼ 20 cm2 V …
- 239000002041 carbon nanotube 0 title abstract description 94
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/05—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
- H01L51/0504—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or swiched, e.g. three-terminal devices
- H01L51/0508—Field-effect devices, e.g. TFTs
- H01L51/0512—Field-effect devices, e.g. TFTs insulated gate field effect transistors
- H01L51/0545—Lateral single gate single channel transistors with inverted structure, i.e. the organic semiconductor layer is formed after the gate electrode
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/0032—Selection of organic semiconducting materials, e.g. organic light sensitive or organic light emitting materials
- H01L51/0045—Carbon containing materials, e.g. carbon nanotubes, fullerenes
- H01L51/0048—Carbon nanotubes
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/05—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
- H01L51/10—Details of devices
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/0001—Processes specially adapted for the manufacture or treatment of devices or of parts thereof
- H01L51/0021—Formation of conductors
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Takahashi et al. | Carbon nanotube active-matrix backplanes for conformal electronics and sensors | |
Lau et al. | Fully printed, high performance carbon nanotube thin-film transistors on flexible substrates | |
Jang et al. | Graphene‐based flexible and stretchable electronics | |
Cao et al. | Screen printing as a scalable and low-cost approach for rigid and flexible thin-film transistors using separated carbon nanotubes | |
Nela et al. | Large-area high-performance flexible pressure sensor with carbon nanotube active matrix for electronic skin | |
Xu et al. | Highly stretchable carbon nanotube transistors with ion gel gate dielectrics | |
Zhang et al. | High-performance carbon nanotube complementary electronics and integrated sensor systems on ultrathin plastic foil | |
Liu et al. | Highly flexible electronics from scalable vertical thin film transistors | |
Liang et al. | Graphene transistors fabricated via transfer-printing in device active-areas on large wafer | |
Choi et al. | Stretchable, transparent, and stretch-unresponsive capacitive touch sensor array with selectively patterned silver nanowires/reduced graphene oxide electrodes | |
Shulaker et al. | Linear increases in carbon nanotube density through multiple transfer technique | |
Artukovic et al. | Transparent and flexible carbon nanotube transistors | |
Kim et al. | High-performance flexible graphene field effect transistors with ion gel gate dielectrics | |
Ha et al. | Aerosol jet printed, low voltage, electrolyte gated carbon nanotube ring oscillators with sub-5 μs stage delays | |
Kim et al. | Coplanar-gate transparent graphene transistors and inverters on plastic | |
Park et al. | Graphene-based conformal devices | |
Lee et al. | Stretchable graphene transistors with printed dielectrics and gate electrodes | |
Lee et al. | 25 GHz embedded-gate graphene transistors with high-K dielectrics on extremely flexible plastic sheets | |
Jeon et al. | Waterproof electronic-bandage with tunable sensitivity for wearable strain sensors | |
Le Borgne et al. | Conformal electronics wrapped around daily life objects using an original method: water transfer printing | |
Lee et al. | Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method | |
Yu et al. | Small hysteresis nanocarbon-based integrated circuits on flexible and transparent plastic substrate | |
Kim et al. | Inkjet printed circuits on flexible and rigid substrates based on ambipolar carbon nanotubes with high operational stability | |
Takahashi et al. | Parallel array InAs nanowire transistors for mechanically bendable, ultrahigh frequency electronics | |
Yang et al. | Microchannel wetting for controllable patterning and alignment of silver nanowire with high resolution |