Zhu et al., 2021 - Google Patents
Nano SiC enhancement in the BN micro structure for high thermal conductivity epoxy compositeZhu et al., 2021
- Document ID
- 6778142973514709538
- Author
- Zhu Y
- Shen X
- Bao D
- Shi Y
- Huang H
- Zhao D
- Wang H
- Publication year
- Publication venue
- Journal of Polymer Research
External Links
Snippet
Improving the heat dissipation efficiency of electronic products is the key to the design of many modern electronic and mechanical systems. Herein, we combined the 3D network fabricating with the way of micron-nano reinforcement to prepare high thermal conductivity …
- 229910010271 silicon carbide 0 title abstract description 244
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