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Rode et al., 2004 - Google Patents

Complexation chemistry in copper plating from citrate baths

Rode et al., 2004

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Document ID
6426285684268580489
Author
Rode S
Henninot C
Vallières C
Matlosz M
Publication year
Publication venue
Journal of the Electrochemical Society

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Snippet

An experimental and theoretical study of the influence of solution chemistry on the electrodeposition of copper from complexing citrate baths is proposed and discussed. The behavior of the system is described in terms of the relative distribution of various copper …
Continue reading at citeseerx.ist.psu.edu (PDF) (other versions)

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

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