Behler et al., 2001 - Google Patents
Comparison of flux application methods for flip chip die bondingBehler et al., 2001
View PDF- Document ID
- 63599807296083892
- Author
- Behler S
- Hartman D
- Publication year
- Publication venue
- Proceedings of Semicon Singapore
External Links
Snippet
Eutectic PbSn and lead-free solder processes will dominate Flip Chip in Package (FCIP) assembly in the future, as many analysts believe. The integration of these processes on a standard die bonder therefore seems very attractive. Stand-alone equipment is already …
- 230000004907 flux 0 title abstract description 74
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
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