Moselund et al., 2007 - Google Patents
Cointegration of gate-all-around MOSFETs and local silicon-on-insulator optical waveguides on bulk siliconMoselund et al., 2007
View PDF- Document ID
- 6239562468026109821
- Author
- Moselund K
- Bouvet D
- Tschuor L
- Pott V
- Dainesi P
- Eggimann C
- Le Thomas N
- Houdre R
- Ionescu A
- Publication year
- Publication venue
- IEEE transactions on nanotechnology
External Links
Snippet
In this work we present a bulk silicon technology platform able to cointegrate gate-all-around (GAA) MOSFETs and local SOI waveguides with pentagonal cross section. Wire diagonals of 100-800 nm are obtained using a lithographic resolution of 0.8 mum. Well-functioning …
- 230000003287 optical 0 title abstract description 51
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
-
- G—PHYSICS
- G02—OPTICS
- G02F—DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction
- G02F1/025—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/10—Light guides of the optical waveguide type
- G02B6/12—Light guides of the optical waveguide type of the integrated circuit kind
- G02B6/122—Light guides of the optical waveguide type of the integrated circuit kind basic optical elements, e.g. light-guiding paths
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8362494B2 (en) | Electro-optic device with novel insulating structure and a method for manufacturing the same | |
Reboud et al. | Germanium based photonic components toward a full silicon/germanium photonic platform | |
Fedeli et al. | Development of silicon photonics devices using microelectronic tools for the integration on top of a CMOS wafer. | |
Marris-Morini et al. | Recent progress in high-speed silicon-based optical modulators | |
US9343638B2 (en) | Electro-optic PN junction modulator formed with a self-aligned process | |
US9274279B1 (en) | Heterogeneous semiconductor photonic integrated circuit with multiple offset heights | |
US10718904B2 (en) | Thin-film integration compatible with silicon photonics foundry production | |
US9678370B2 (en) | Carrier-depletion based silicon waveguide resonant cavity modulator with integrated optical power monitor | |
Ang et al. | Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform | |
JP2019215488A (en) | Electrooptical modulator | |
US6653161B1 (en) | Method and apparatus for forming a capacitive structure including single crystal silicon | |
US7657146B2 (en) | Optoelectric high frequency modulator integrated on silicon | |
WO2010151224A1 (en) | Thin-film solar cell interconnection | |
WO2022043513A1 (en) | Diode with light-sensitive intrinsic region | |
US8728837B2 (en) | Enhancing uniformity of slab region thickness in optical components | |
Moselund et al. | Cointegration of gate-all-around MOSFETs and local silicon-on-insulator optical waveguides on bulk silicon | |
Vehmas et al. | Monolithic integration of up to 40 GHz Ge photodetectors in 3um SOI | |
US8078016B2 (en) | Optical circuit device and method | |
Aalto et al. | Monolithic Ge integration on the 3 µm SOI platform for 40 GHz photodiodes | |
Benedikovic et al. | High-performance waveguide photodetectors based on lateral Si/Ge/Si heterojunction | |
US9684194B2 (en) | Method for making electro-optical device | |
Xu | Germanium-Tin Photo Detectors for Applications in the Two Micron Wavelength Range | |
US20240337870A1 (en) | Integration of advanced photonic materials in silicon photonic platform | |
Xu et al. | Toward Monolithic Optoelectronic Integration of GeSn Photodiode and FinFET on GeSnOI Platform | |
Lim et al. | Germanium electro-absorption modulator for power efficient optical links |