Babaei et al., 2020 - Google Patents
Investigating the Au-Cu thick layers electrodeposition rate with pulsed current by optimization of the operation conditionBabaei et al., 2020
View PDF- Document ID
- 6074718389760561679
- Author
- Babaei H
- Khosravi M
- Sovizi M
- Khorramie S
- Publication year
- Publication venue
- Journal of Electrochemical Science and Technology
External Links
Snippet
The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of …
- 238000004070 electrodeposition 0 title abstract description 30
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- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1601—Process or apparatus
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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