Nandi et al., 2017 - Google Patents
Resistive Switching in Transition Metal Oxides for Integrated Non-volatile MemoryNandi et al., 2017
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- 6009305639835626928
- Author
- Nandi S
- et al.
- Publication year
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Transition metal oxides (TMOs) exhibit characteristic resistance changes when subjected to high electric fields due to the creation, drift and diffusion of defects, and this resistive- switching response is of interest for future non-volatile memory applications. Indeed …
- 230000015654 memory 0 title abstract description 106
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- H01L45/00—Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/12—Details
- H01L45/122—Device geometry
- H01L45/1233—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/14—Selection of switching materials
- H01L45/145—Oxides or nitrides
- H01L45/146—Binary metal oxides, e.g. TaOx
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/16—Manufacturing
- H01L45/1608—Formation of the switching material, e.g. layer deposition
- H01L45/1625—Formation of the switching material, e.g. layer deposition by physical vapor deposition, e.g. sputtering
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/14—Selection of switching materials
- H01L45/141—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H01L45/144—Tellurides, e.g. GeSbTe
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/14—Selection of switching materials
- H01L45/141—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H01L45/143—Selenides, e.g. GeSe
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/12—Details
- H01L45/1253—Electrodes
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/06—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
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- H01L45/04—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
- H01L45/08—Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory based on migration or redistribution of ionic species, e.g. anions, vacancies
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/24—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including solid state components for rectifying, amplifying or switching without a potential-jump barrier or surface barrier, e.g. resistance switching non-volatile memory structures
- H01L27/2463—Arrangements comprising multiple bistable or multistable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays, details of the horizontal layout
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- H01L27/24—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including solid state components for rectifying, amplifying or switching without a potential-jump barrier or surface barrier, e.g. resistance switching non-volatile memory structures
- H01L27/2409—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including solid state components for rectifying, amplifying or switching without a potential-jump barrier or surface barrier, e.g. resistance switching non-volatile memory structures comprising two-terminal selection components, e.g. diodes
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00 - G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00 - G11C25/00 using resistance random access memory [RRAM] elements
- G11C13/0021—Auxiliary circuits
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- H01L29/40—Electrodes; Multistep manufacturing processes therefor
- H01L29/43—Electrodes; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/516—Insulating materials associated therewith with at least one ferroelectric layer
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
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