[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Arai et al., 2018 - Google Patents

Visualization of Two-Phase Flow in 3D Printed Polycarbonate Pulsating Heat Pipe With Aluminum Substrate

Arai et al., 2018

Document ID
5728331494760474673
Author
Arai T
Kawaji M
Koito Y
Publication year
Publication venue
International Conference on Nanochannels, Microchannels, and Minichannels

External Links

Snippet

A pulsating heat pipe (PHP) is a passive device with a good heat transport capability compared to other heat pipes. This paper describes an experimental investigation of a PHP with a serpentine channel fabricated by using a 3-D printer. The configuration of the flow …
Continue reading at asmedigitalcollection.asme.org (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185Heat-exchange surfaces provided with microstructures or with porous coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00Elements not covered by group F28F1/00, F28F3/00 or F28F5/00

Similar Documents

Publication Publication Date Title
Iradukunda et al. A review of advanced thermal management solutions and the implications for integration in high-voltage packages
Wan et al. Experimental study and optimization of pin fin shapes in flow boiling of micro pin fin heat sinks
Jaikumar et al. Enhanced pool boiling for electronics cooling using porous fin tops on open microchannels with FC-87
Chien et al. Experimental study on convective boiling flow and heat transfer in a microgap enhanced with a staggered arrangement of nucleated micro-pin-fins
Asrar et al. Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins
Li et al. A compact loop heat pipe with flat square evaporator for high power chip cooling
Qiu et al. Experimental study of flow boiling heat transfer and pressure drop in stepped oblique-finned microchannel heat sink
Mehta et al. Experimental investigation of the thermal performance of closed loop flat plate oscillating heat pipe
Bar-Cohen et al. Waves, instabilities, and rivulets in high quality microgap two-phase flow
Tan et al. Enhancement of flow boiling in the microchannel with a bionic gradient wetting surface
Kong et al. Design of additively manufactured hybrid PCM-air heat sink with a two-stage channel for enhancing thermal performance
Ivanova et al. Design, fabrication and test of silicon heat pipes with radial microcapillary grooves
Arai et al. Visualization of Two-Phase Flow in 3D Printed Polycarbonate Pulsating Heat Pipe With Aluminum Substrate
Winter et al. The capillary length scale determines the influence of bubble-fin interactions and prediction of pool boiling from heat sinks
Jang et al. Thermal spreading characteristics of novel radial pulsating heat pipes with diverging nonuniform channels
JP2011196659A (en) Porous body, boil cooling device, boil cooling system, power generation system, and boil cooling method
Asrar et al. Flow boiling of R245fa in a microgap with integrated staggered pin fins
Tecchio et al. Thermal performance of thermosyphons in series connected by thermal plugs
Deisenroth et al. Heat transfer and two-phase flow regimes in manifolded microgaps-R245fa empirical results
Hsieh et al. Low Reynolds numbers convective heat transfer in single/two-phase roughened microchannels
Omisanya et al. Flow boiling critical heat flux enhancement via different-mode-interacting boiling in narrow gaps
Ni et al. Experimental and computational investigation on synergistic enhancement spray cooling using micropillars and capillary-driven wicking hybrid structures
Arai et al. Two-phase flow and heat transport in 3-d printed pulsating heat pipes with different channel sizes
Nishimura et al. Evaluation of forced convective boiling heat transfer with layered parallel microchannels
Buchling et al. Vapor chamber forced convection cooling using flow boiling in open microchannels and tapered manifolds