[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Kazui et al., 2006 - Google Patents

Measurement of cross section of an LSI wafer by inverse stereo matching

Kazui et al., 2006

Document ID
4993223228970244738
Author
Kazui M
Ikeda M
Takane A
Publication year
Publication venue
Electronics and Communications in Japan (Part II: Electronics)

External Links

Snippet

This research paper proposes a novel method for estimating the cross‐sectional shape of an LSI wafer from a stereo image of an electron microscope. Three‐dimensional measurement of an LSI wafer is critical in systems that perform nondestructive dimensional measurement …
Continue reading at onlinelibrary.wiley.com (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical means
    • G01B11/02—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical means
    • G01B11/24—Measuring arrangements characterised by the use of optical means for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30004—Biomedical image processing

Similar Documents

Publication Publication Date Title
JP5439575B2 (en) Sample observation method
US9449790B2 (en) Pattern shape evaluation method, semiconductor device manufacturing method, and pattern shape evaluation device
KR101477014B1 (en) Three-dimensional mapping using scanning electron microscope images
US8604431B2 (en) Pattern-height measuring apparatus and pattern-height measuring method
US8988521B2 (en) Method of measuring critical dimension of pattern and apparatus for performing the same
US20090214103A1 (en) Method for measuring a pattern dimension
JP3841024B2 (en) Three-dimensional shape measuring apparatus and etching condition setting method
US8330104B2 (en) Pattern measurement apparatus and pattern measurement method
JP4500099B2 (en) Electron microscope apparatus system and dimension measuring method using electron microscope apparatus system
US10665424B2 (en) Pattern measuring method and pattern measuring apparatus
JP4500653B2 (en) Sample observation method and apparatus
JP4240066B2 (en) Etching process monitoring method and etching process control method
US8759763B2 (en) Method and apparatus to measure step height of device using scanning electron microscope
KR102483920B1 (en) Methods for Characterization by CD-SEM Scanning Electron Microscopy
KR102533220B1 (en) How to implement CD-SEM characterization techniques
JP5880134B2 (en) Pattern measuring method and pattern measuring apparatus
US20140312225A1 (en) Defect inspection apparatus and defect inspection method
Kazui et al. Measurement of cross section of an LSI wafer by inverse stereo matching
TW202013250A (en) Pattern shape evaluation device, pattern shape evaluation system, and pattern shape evaluation method
KR20200036936A (en) Charged particle beam device, section shape estimation program
Chen et al. Robust surface reconstruction in SEM using two BSE detectors
US9200896B2 (en) Pattern dimension measurement method and charged particle beam microscope used in same
Chen et al. Robust surface reconstruction in sem with two bse detectors
US7098456B1 (en) Method and apparatus for accurate e-beam metrology
TW201939565A (en) Charged-particle beam device and cross-sectional shape estimation program