Fujita et al., 2009 - Google Patents
Low-stress dicing assisted by pulsed laser for multilayer MEMSFujita et al., 2009
- Document ID
- 4876246201061198877
- Author
- Fujita M
- Izawa Y
- Tsurumi Y
- Tanaka S
- Fukushi H
- Sueda K
- Nakata Y
- Miyanaga N
- Esashi M
- Publication year
- Publication venue
- Laser-based Micro-and Nanopackaging and Assembly III
External Links
Snippet
We have developed a novel debris-free in-air laser dicing technology, which is expected to give less failure of MEMS devices and hence improves yields. Our technology combines two processes: a dicing guide fabrication and a wafer separation process. The first process is …
- 235000012431 wafers 0 abstract description 51
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2201/00—Articles made by soldering, welding or cutting by applying heat locally
- B23K2201/36—Electric or electronic devices
- B23K2201/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0054—Working by transmitting the laser beam within the workpiece
- B23K26/0057—Working by transmitting the laser beam within the workpiece by modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press; Diffusion bonding
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4907984B2 (en) | Laser processing method and semiconductor chip | |
TWI380867B (en) | Laser processing methods and semiconductor wafers | |
JP4781661B2 (en) | Laser processing method | |
US9676167B2 (en) | Laser processing of sapphire substrate and related applications | |
JP4606741B2 (en) | Processing object cutting method | |
JP4954653B2 (en) | Laser processing method | |
JP4751319B2 (en) | Focusing light beam to two focal points | |
US20150151380A1 (en) | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses | |
JP2007013056A (en) | Method for cutting work to be machined | |
Liao et al. | High quality full ablation cutting and stealth dicing of silica glass using picosecond laser Bessel beam with burst mode | |
KR20170003898A (en) | Method and apparatus for performing laser filamentation within transparent materials | |
TWI647187B (en) | Method of separating a glass sheet from a carrier | |
JP5322418B2 (en) | Laser processing method and laser processing apparatus | |
JP2006305586A (en) | Method for cutting plate-shaped body, and laser beam machining device | |
JP2009039755A (en) | Machining method for cutting | |
JP4167094B2 (en) | Laser processing method | |
JP2006231413A (en) | Laser beam machining method | |
JP2007136554A (en) | Laser beam machining method | |
JP4527098B2 (en) | Laser processing method | |
WO2012063348A1 (en) | Laser processing method and device | |
KR101232008B1 (en) | The depth of the modified cutting device through a combination of characteristics | |
Savriama et al. | Crack-free laser dicing of glass in the microelectronics industry | |
WO2004080642A1 (en) | Laser beam machining method | |
Fujita et al. | Low-stress dicing assisted by pulsed laser for multilayer MEMS | |
Segall et al. | Fracture control of unsupported ceramics during laser machining using a simultaneous prescore |