[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Sandstrom et al., 2009 - Google Patents

W-band CMOS amplifiers achieving $+ $10 dBm saturated output power and 7.5 dB NF

Sandstrom et al., 2009

View PDF
Document ID
4633756517040454569
Author
Sandstrom D
Varonen M
Karkkainen M
Halonen K
Publication year
Publication venue
IEEE Journal of Solid-State Circuits

External Links

Snippet

We present two W-band amplifiers, one implemented using conventional coplanar waveguides and unshielded passives and the other using slow-wave shielded waveguides and passives, realized in a 65-nm baseline CMOS technology. The measured results …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6605High-frequency electrical connections
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements

Similar Documents

Publication Publication Date Title
Sandstrom et al. W-band CMOS amplifiers achieving $+ $10 dBm saturated output power and 7.5 dB NF
Doan et al. Millimeter-wave CMOS design
Varonen et al. Millimeter-wave integrated circuits in 65-nm CMOS
Komijani et al. A 24-GHz,+ 14.5-dBm fully integrated power amplifier in 0.18-/spl mu/m CMOS
Parveg et al. Design of a D-band CMOS amplifier utilizing coupled slow-wave coplanar waveguides
Pellerano et al. A 64 GHz LNA with 15.5 dB gain and 6.5 dB NF in 90 nm CMOS
Cheung et al. Shielded passive devices for silicon-based monolithic microwave and millimeter-wave integrated circuits
Wang et al. A CMOS 210-GHz fundamental transceiver with OOK modulation
Kleveland et al. Exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design
Mitomo et al. A 60-GHz CMOS receiver front-end with frequency synthesizer
Seo et al. A 150 GHz Amplifier With 8 dB Gain and $+ $6 dBm $ P_ {\rm sat} $ in Digital 65 nm CMOS Using Dummy-Prefilled Microstrip Lines
Fujishima et al. Tehrahertz CMOS design for low-power and high-speed wireless communication
Mao et al. 125-GHz Diode Frequency Doubler in 0.13-$\mu {\hbox {m}} $ CMOS
Karaca et al. A 53–117 GHz LNA in 28-nm FDSOI CMOS
Sinha et al. Flip-chip approach for 500 GHz broadband interconnects
Mazor et al. A SiGe distributed millimeter-wave frequency tripler
Long Passive components for silicon RF and MMIC design
Ferndahl et al. 40 and 60 GHz frequency doublers in 90-nm CMOS
Varonen et al. Millimeter-wave amplifiers in 65-nm CMOS
Testa et al. 110 GHz travelling-wave amplifier in 22 nm FD-SOI CMOS
Eriksson et al. Suppression of parasitic substrate modes in multilayer integrated circuits
Pavageau et al. A 7-dB 43-GHz CMOS distributed amplifier on high-resistivity SOI substrates
Moez et al. A new loss compensation technique for CMOS distributed amplifiers
Lee et al. Advanced design of broadband distributed amplifier using a SiGe BiCMOS technology
Plouchart et al. Application of an SOI 0.12-µm CMOS technology to SoCs with low-power and high-frequency circuits