Zhu et al., 2021 - Google Patents
Maximized atomic disordering approach boost the thermoelectric performance of Mg2Sn through the self-compensation effect and steric effectZhu et al., 2021
View PDF- Document ID
- 4554518281630898962
- Author
- Zhu Y
- Dong E
- Han Z
- Jiang F
- Sui J
- Zhang W
- Liu W
- Publication year
- Publication venue
- Acta Materialia
External Links
Snippet
Atomic disordering was an effective strategy to reduce lattice thermal conductivity. In this work, the atomic disordering of Mg 2-δ Sn 1-x Bi x was maximized by both the charge self- compensation and steric effects. Due to the strong phonon scattering arose from …
- 230000003335 steric effect 0 title abstract description 14
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/12—Selection of the material for the legs of the junction
- H01L35/14—Selection of the material for the legs of the junction using inorganic compositions
- H01L35/18—Selection of the material for the legs of the junction using inorganic compositions comprising arsenic or antimony or bismuth, e.g. AIIIBV compounds
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/12—Selection of the material for the legs of the junction
- H01L35/14—Selection of the material for the legs of the junction using inorganic compositions
- H01L35/22—Selection of the material for the legs of the junction using inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen or germanium or silicon, e.g. superconductors
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/12—Selection of the material for the legs of the junction
- H01L35/14—Selection of the material for the legs of the junction using inorganic compositions
- H01L35/16—Selection of the material for the legs of the junction using inorganic compositions comprising tellurium or selenium or sulfur
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/12—Selection of the material for the legs of the junction
- H01L35/14—Selection of the material for the legs of the junction using inorganic compositions
- H01L35/20—Selection of the material for the legs of the junction using inorganic compositions comprising metals only
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/28—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof operating with Peltier or Seebeck effect only
- H01L35/32—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof operating with Peltier or Seebeck effect only characterised by the structure or configuration of the cell or thermo-couple forming the device including details about, e.g., housing, insulation, geometry, module
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/28—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof operating with Peltier or Seebeck effect only
- H01L35/30—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof operating with Peltier or Seebeck effect only characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/34—Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/02—Details
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L39/00—Devices using superconductivity; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
- H01L39/02—Details
- H01L39/12—Details characterised by the material
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies; Multistep manufacturing processes therefor characterised by the materials of which they are formed
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Xing et al. | Superior performance and high service stability for GeTe-based thermoelectric compounds | |
Chauhan et al. | Compositional tuning of ZrNiSn half-Heusler alloys: Thermoelectric characteristics and performance analysis | |
Ohno et al. | Phase boundary mapping to obtain n-type Mg3Sb2-based thermoelectrics | |
Tavassoli et al. | On the Half-Heusler compounds Nb1-x {Ti, Zr, Hf} xFeSb: Phase relations, thermoelectric properties at low and high temperature, and mechanical properties | |
Shutoh et al. | Thermoelectric properties of the Tix (Zr0. 5Hf0. 5) 1− xNiSn half-Heusler compounds | |
He et al. | Enhanced thermoelectric properties of n-type NbCoSn half-Heusler by improving phase purity | |
Khan et al. | Thermoelectric properties of highly efficient Bi-doped Mg2Si1− x− ySnxGey materials | |
El-Khouly et al. | Optimizing the thermoelectric performance of FeVSb half-Heusler compound via Hf–Ti double doping | |
Wang et al. | Enhanced thermoelectric performance in Ti (Fe, Co, Ni) Sb pseudo-ternary half-Heusler alloys | |
Zhu et al. | Maximized atomic disordering approach boost the thermoelectric performance of Mg2Sn through the self-compensation effect and steric effect | |
Kuo et al. | Optimization of thermoelectric performance of SrSi2-based alloys via the modification in band structure and phonon-point-defect scattering | |
Ren et al. | Intermediate-level doping strategy to simultaneously optimize power factor and phonon thermal conductivity for improving thermoelectric figure of merit | |
Rogl et al. | New p-and n-type skutterudites with ZT> 1 and nearly identical thermal expansion and mechanical properties | |
Mo et al. | High thermoelectric performance at room temperature of n-type Mg3Bi2-based materials by Se doping | |
Guo et al. | Enhanced thermoelectric performance of P-type CaMg2Bi1. 98 and optimized CaAl2Si2-type Zintl phase module with equal cross-section area | |
Yamamoto et al. | The potential of FeVSb half-Heusler phase for practical thermoelectric material | |
Jovovic et al. | Doping effects on the thermoelectric properties of AgSbTe 2 | |
Yan et al. | Realizing p-type NbCoSn half-Heusler compounds with enhanced thermoelectric performance via Sc substitution | |
Yu et al. | Rapid preparation and thermoelectric properties of Ba and In double-filled p-type skutterudite bulk materials | |
Chauhan et al. | Contrasting role of bismuth doping on the thermoelectric performance of VFeSb half-Heusler | |
Lee et al. | Improved carrier transport properties by I-doping in n-type Cu0. 008Bi2Te2. 7Se0. 3 thermoelectric alloys | |
Yang et al. | Extended phase homogeneity and improved out-of-plane charge transfer in Sb and Te co-alloyed n-type BiSe layered compound with extraordinary thermoelectric performance | |
Peng et al. | Synthesis and thermoelectric properties of the double-filled skutterudite Yb 0.2 In y Co 4 Sb 12 | |
Jiang et al. | Boosting room-temperature thermoelectric performance of Mg3Sb1. 5Bi0. 5 material through breaking the contradiction between carrier concentration and carrier mobility | |
Zhang et al. | Designing vacancy-filled Heusler thermoelectric semiconductors by the Slater-Pauling rule |