Grade et al., 1997 - Google Patents
Wafer-scale processing, assembly, and testing of tunneling infrared detectorsGrade et al., 1997
- Document ID
- 4508499171060695080
- Author
- Grade J
- Barzilai A
- Reynolds J
- Liu C
- Partridge A
- Jerman H
- Kenny T
- Publication year
- Publication venue
- Proceedings of International Solid State Sensors and Actuators Conference (Transducers' 97)
External Links
Snippet
The individual assembly of early tunneling sensors required time and skill which were incompatible with high volume production and which produced a very large variation in key device operating parameters. This paper describes the first successful fully wafer-scale …
- 230000005641 tunneling 0 title abstract description 36
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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