Barz et al., 2016 - Google Patents
Wafer-level shellac-based interconnection process for ultrathin silicon chips of arbitrary shapeBarz et al., 2016
View PDF- Document ID
- 449189730003814633
- Author
- Barz F
- Lausecker R
- Wallrabe U
- Ruther P
- Paul O
- Publication year
- Publication venue
- 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS)
External Links
Snippet
This work addresses the interfacing of ultrathin microchips based on silicon (Si) with highly flexible, polymer-based cables of several centimeters in length. More specifically, we target chronically implantable neural probes with cross-sections as small as 120× 50 μm2 …
- 238000000034 method 0 title abstract description 29
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